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Fabrication Mechanical Properties,and Application Study Of Ultra-thin Silicon

Posted on:2014-07-26Degree:MasterType:Thesis
Country:ChinaCandidate:S Q XuFull Text:PDF
GTID:2252330425957210Subject:Condensed matter physics
Abstract/Summary:PDF Full Text Request
With the rapid development of science and technology, to reduce the power consumption of the device to reduce the volume of devices and improve device integration calls for more and more. In such circumstances, the silicon wafer thinning technology development has increasingly fast, lead to more widely application of ultra-thin silicon. one application is used to improve the quality of the optical imaging decline due to atmospheric turbulence. Increasing the requirements of the resolution and image quality of optical imaging devices, especially in high-resolution long focal length space investigation camera research has attracted attention in the national military field. In all these studies, adaptive optics imaging technology has always played an important role. Adaptive optical imaging technology refers to under the control of the computer, by changing the curvature of the surface of the main lens to compensate for atmospheric changes and temperature changes lead to the imaging distortion. The basic structure of the adaptive optics system is composed of three parts:the wave-front sensor, deformable mirror and wave-front controller. The most important part is a deformable mirror, and its surface quality, volume, size, power consumption, the response time, and so on determines the performance of the adaptive optics system.This thesis starting from the preparation of the importance and feasibility of ultra-thin silicon, then explore the silicon thickness of silicon bring changes in mechanical properties, and on this basis, the resulting conclusion of the study is applied to practical problems-deformable mirror. Through discussion of research status at home and abroad on the deformable mirror and the problems encountered by, analyzes and explore solutions for a variety of issues, determined to drive continuous surface electrostatic deformable mirror model. From the parallel plate capacitor plate theory, the mechanical characteristics of ultra-thin silicon-depth analysis of the structural design, static deformation characteristics of the dynamic response and ultimate failure, discuss the mirror size, thickness, number of electrodes, electrode size structure parameters of the deformable mirror related performance impact. By studying the parallel plate capacitor plate theory, the mechanical properties of ultra-thin silicon. In-depth analysis of the structural design, static deformation dynamic response and ultimate failure characteristics, and discuss the structural parameters of the mirror size, thickness, number of electrodes, electrode size, related to the performance impact on the deformable mirror. Searching for a simple structure, easy fabrication, and real-time controlled micro mirror. By the above theory and data simulation to determine the parameters of the best deformable mirror structure, and designed respectively and successfully create effective reflective area of30*30,39electrodes and169electrodes of ultra-thin silicon membrane deformable mirror.
Keywords/Search Tags:ultra-thin wafers, Electrostatic actuation, Deformable mirror
PDF Full Text Request
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