Analysis Of Coupling Of Thermal Stress Deformation And Flow Field Of Mechanical Seal

Mechanical seal is used widely by the process equipment of petroleum, chemical engineering, medical treatment, food, energy and so on. Reliability and stability of mechanical equipment is important to operation, and therefore, the mechanical seal occupies an essential position in the machinery and equipment. The relative rotate between the stationary ring and dynamic ring lead to friction heat, when mechanical seal at work, which create temperature rises of seal face, resulting in heat loss and thermal stress existed. Because fretting wear, reducing the mechanical seal service life. Because the mechanical seal face is affected, by media pressure, the spring force and the film pressure loads, so that the seal faces generate pressure deformation. Meanwhile the seal face are loaded by thermal stress coupled resulting in deformation of the sealing ring, and then change the shape of the sealing ring, thickness, pressure, flow rate and other parameters. The above influence is connection with the leakage of mechanical seal. Therefore, in order to ensure stability and to improve the operation of the mechanical seal, under coupling thermal-mechanical of mechanical seal ring deformation analysis and flow field analysis are very important.In this paper, to compare with distribution of temperature field of dynamic ring face, thermal distortion, pressure distortion and deformation of coupling of thermal stress by the ANSYS program. The research indicates that dynamic ring face distribution of temperature is gradient, because of friction heat, which is temperature decreases with increase radius. Thermal deformation generates dynamic ring face tensile displacement and the displacement decreases with increase radius. The influence of pressure distortion is opposite the influence of thermal distortion. The maximum compression displacement is generated in the internal radius and the maximum tensile displacement is generated in external radius, coupling of thermal stress deformation is between the above two deformation. Therefore, considering the seal face deformation under coupled thermal stress is lower than the deformation under thermal distortion or pressure distortion.Based on the analysis of the coupled thermal-mechanical deformation, the film features without deformation and the film features with the coupled thermal-mechanical deformation have a comparative analysis, and the result:whether the dynamic ring has deformation or not, the film stress increases with radius, but the film pressure is lower under coupled thermal stress deformation, whether the dynamic ring has deformation or not, the flow rate increases with radius and the flow rate under coupled thermal-mechanical distortion is larger. Because the film thickness is larger under coupled thermal-mechanical distortion, reducing film opening force. Because flow rate go up under coupled thermal stress, resulting in leakage of mechanical seal become larger. According to the experiment, the real leakage is larger than the leakage of simulation, because the friction between the sealing rings and the vibration are not considered.