Research On Complex Anodic Bonding Process And Equipment Based On Dielectric Barrier Discharge

Anodic bonding technology has been widely used in MEMS. Anodic bonding is oneof the important package technology in MEMS. MEMS is a emerging technology. It is acombination of micromachining technology and microelectronics technology. It can beused to produce mechanical and electrical microdevice, and even a new type of optical andelectrical devices. Anodic bonding technology has not only been used in the field ofmicro-machined, micro-sensors, micro-instrument manufacturing, but also in the powervacuum, aerospace, solar cell manufacturing. It also has a high value in other fields. Withthe development of MEMS and various other areas, new requirements are proposed to theanodic bonding technique. The current research focused on low temperature anodicbonding, and anodic bonding of heterogeneous materials.In this paper, aiming at low temperature anodic bonding, a anodic bonding processusing dielectric barrier discharge surface treatment is studied.The experimental platform for the dielectric barrier discharge test is structured.Glow-like discharge is exhibited in dielectric barrier discharge at atmospheric pressure.Orthogonal experimental method is used to analyze the various process parameters.The mainly affecting parameters are: discharge voltage, frequency, discharge gap, thebonding temperature, bonding voltage. Bonding temperature which is still the mostimportant factor.