Electrochemical Mechanism Of The Process Of Preparing A Carrier Layer Of Ultra-thin Copper Foil And Peel

Copper is a good conductor of electricity that not only have a lower prices but also processed easily, thus electrolytic copper foil is widely used in the printed circuit board and the anode fluid of lithium ion battery. In recent years, with the development of the printed circuit board and lithium ion battery to more electronic and the electrical equipment to a thin and short, Electrolytic copper foil is also asked to more thin trend. The ultra-thin electrolytic copper foil with carrier support will be the important research direction for electrolytic copper foil. According the view that the preparation technology of the ultra-thin electrolytic copper foil with carrier support in China is inadequate and the patent is mostly invented by foreign enterprise scholars, this article suggests that zinc nickel alloy is first electroplated on a35μm carrier copper foil surface, then the electroplating of ultra-thin copper foil layer process, and the ultra-thin electrolytic copper foil with carrier support with a stability peelable strength will be obtained.This paper systematically researches the preparation of the ultra-thin copper foil with carrier support which the support can be stripped of ultra-thin copper foil. First, the zinc nickel alloy, called stripping layer, electroplates on the35micron copper foil in the Potassium Pyrophosphate trihydrate system, then ultra-thin copper foil electroplates on the stripping layer in Potassium pyrophosphate trihydrate system. Methods of SEM, ED AX are used to make microstructure and physical phase analysis for ultra-thin copper foil and stripping layer. The cathode steady-state polarization curves, Circulation current-voltage curve, Dissolution current-voltage curve and Timing current curve of Zinc-Nickel alloy in electrodeposition are measured by Electrochemical workstations to analyse the electrolyte process.The experimental results show that, electrodeposit Zinc-Nickel alloy coatings on the surface of shining carrier foil are finshed in the Potassium pyrophosphate trihydrate system. Best formula of electrodeposit Zinc-Nickel alloy coatings in the Potassium pyrophosphate trihydrate system are as follows:K4P2O7·3H2O0.5mol·L-’;[Zn2+]:[Ni2+]=4:1; Gelatin0.2～0.5g·L-1and Sodium dodecylbenzenesulfonate0.2-0.4g·L-1. The best technology of ultrathin copper foil layer by Electroplating copper with pyrophosphater salt are at current density2A·dm-2, electroplating time6s, electrolyte temperature45℃; The BSE of the longitudinal profile of ultra-thin copper foil with carrier support shows that the peel strength of ultra-thin copper foil with carrier support have a close relationship about stripping layer, production process of stripping layer and production process of copper foil layer.Electrochemical analysis results from Zinc-Nickel alloy stripping layer in Potassium pyrophosphate trihydrate system show that Zinc-Nickel alloy is a low consolute metal, the co-deposition of Zn and Ni is a quasireversible process controlled by diffusion, the way of the electrochemical crystallization is instantaneous nucleation model.