Research On3-mm Transceiver Front-end Miniaturization

Millimeter-wave transceiver Front-end miniaturization design is the future trend of the development in millimeter-wave communication system, innovation of structure and adopting reasonable advanced assembly technology is the important way to realize the front-end miniaturization. In this thesis, a large number of active and passive circuit are designed to verify the advantage in the millimeter-wave Miniaturized and High integrated circuit design using HMIC technology and LTCC technology which offer many in-depth research results in the development of future high-frequency electronic system.Firstly, the process characteristics of LTCC technology in domestic and foreign development are introduced in this paper. Secondly, combining the indicators and requirements, all kinds of required passive circuit and active circuit are designed for millimeters-wave front-end such as Different-layer interconnect structure analysis based on LTCC technology, waveguide to microstrip transition design using LTCC technology, W-band broadband power-divider design and W-band band-pass filter design. A novel Ka-band folded dual-mode Bandpass Filter with LTCC Technology is introduced and simulated to demonstrate the application of this technology for designing the compact3D dual-mode filters successfully. The W-band Broadband T-splitters with SIW technology use a middle metal layer to join metal holes in different layers can effective to prevent the occurrence of broken hole processing. Then a W-band switch and a related component were designed using HMIC technology to verify the feasibility of the scheme. The switch using the traditional fin-line technology has realized the high isolation and low-loss insertion in3mm band with pass band isolation degree better than23dB and insertion loss less than2dB. Finally a W-band transceiver front-end adopting FerroA6M ceramic raw materials based on LTCC technology has been designed and tested. The W-band transceiver front-end has achieved the goal of miniaturization and high integration in the55mm×50mm×4mm cavity.The successful component units such as passive circuit and active circuit refered in this paper have practical reference meaning to the following research. The design of transceiver front-end based on LTCC technology also has contributed to the subsequent related research.