Synthesis And Thermal Properties Of Benzocyclobutene Based Resinshaving Crosslinking Structure And Curing Behavior

It is known that benzocyclobutene(BCB) resins possess many advantages, such as low dielectric costant, outstanding film-forming performance and low moisture absorption, especially are widely used in microelectronics field. The production of Integrated Circuit(IC) molding process need to experience the annealing treatment in400℃, but the thermal stability of lots of dielectric materials doesn’t meet the requirement of the packaging process. In this paper, a series of new benzocyclobutene based resins were conveniently prepared. Introduce rigid groups and double bond structure, in order to form thermoset resins after crosslinking cured. meanwhile the curing process, polymer thermal stability and film properties of them were studied.The Mainchain Benzocyclobutene-containing oligmeric polyphenylvinylene(BOPV)was synthesized. Introduce benzocyclobutene structure into the main chain by the Heck coupling reaction, to improve the heat resistant performance of the polymer. And the introduction of double bond to enhance the degree of crosslinking, improving its thermal stability. Results show that the carbon residue rate of BOPV oligomer was 56%and the 5% weight loss temperature was 456℃. Compared with the DVS-BCB resins,polyvinylbenzocyclobutene resins, the BOPV oligomer had excellent thermal stability.Two new kinds of allyl benzocyclubutene based organosilion resins were synthesized successfully, Combining benzocyclobutene with organosilicon by the Heck coupling reaction.The mechanism of crosslinking cured was disscussied via FT-IR and DSC,meanwhile the thermal stability and film properties of them were studied.The results show that the resins had good surface roughness and outstanding heat resistance, the 5%weight loss temperature was about 417℃. The different groups(phenyl and methyl)connected with silicon had little effect on its thermal stability, further illustrate the improvement of heat resistant performance was closely related to the crosslinking of double bond.1-DMVSBCB monomer was synthesized successfully using multiple methods, and the synthesis conditions were optimized. The ring-opening temperature of itshomopolymer were studied. The results show that the initial ring-opening temperature was 120℃, lower about 45℃ than 4-DMVSBCB. The 1-DMVSBCB monomer, studied the optimization of reaction conditions, with 4-DMVSPh and 4-DMVSBCB anionic copolymerization respectively. At room temperature under the condition of bulk polymerization, S-BuLi as initiator and the addition amont of 5% mole ratio. The copolymers was prepared in different percentage successfully. The performance of copolymers, the curing process, polymer thermal stability and film properties, were studied in detailed. The results show that the new silicon-containing benocyclobutene based resins had excellent heat resistance and film roughness. 5% cured weight loss temperature was similar to DVS-BCB resins and 4-DMVSBCB resins, having huge potential applications in the field of low dielectric.