The Study Of Polymer Micro-Structure Plate To Plate Hot Embossing Process

Plate to Plate (P2P) hot embossing is a common technology of manufacturing micro-nano structure. P2P hot embossing has the advantages of high forming precision and process controllable. The technology has important application in Micro Electro Mechanical System(MEMS),Micro Optic Electro Mechanical System(MOEMS),Bio Micro Electro Mechanical System(BioMEMS)and information technology. But P2P hot embossing birth defects due to the mold configuration structure which restricts the P2P hot pressing technology for the long-term development in the field of industrial, these defects are: intermittent manufacturing long cycle time, copying the area is finite, low production efficiency.This paper puts forward step & repeat P2P hot embossing makes P2P hot embossing to be a continuous and automation process. Continuous P2P hot embossing process keeps vertical and horizontal reciprocating movement of the plate mold to be linkage controlling, the flat mold reciprocating hot emboss on a continuous polymer sheet with constant speed. This continuous process significantly improves the work efficiency, extend the copy area of single plate mold. The step & repeat P2P hot embossing continuous forming device is reliable, continuous and efficient.According to the polymer with different assemble state has different change rule between mechanical properties and temperature, this paper proposes two non-isothermal hot embossing processes which respectively applied to the amorphous and crystallization polymer. By using different polymer stress-strain behavior versus temperature change rules, simplifies the hot-pressing process, avoids the time consuming in conventional hot embossing caused by repeated mold heating cooling, shortens the cycle time significantly. Through finite element simulation analysis and experimental study confirm the non-isothermal hot embossing process is feasible and reliable.This paper discusses deforming principle of the polymer micro hot embossing in solid state, the size-dependent effect of the polymer material performance and influence factors of microstructure deformation resilience; Using the finite element simulation analysis method to study the influence of process parameters and die structure in the hot embossing. The study has important guiding significance for designing the non-isothermal hot embossing process and P2P hot-embossing continuous forming device.Designed continuous hot embossing forming device, the non-isothermal hot embossing process and its control method, which constitutes a new P2P hot embossing technology:Stepping Non-Isothermal Plate to Plate Hot Embossing in Solid State (SNI-P2P). SNI-P2P hot embossing technology keeps the advantage of conventional P2P hot embossing. It can significantly improve the efficiency, extend the copy area, reduce the cost. The paper develops and proposes a new way for P2P hot embossing in further industrial application.