Experimental Study On Ultrasonic Assisted Grinding Of Sicceramics With Brazed Diamond Grinding Wheel Of Defined Grain Distribution

Ultrasonic Assisted Grinding(UAG) is a hybrid machining process that combines the advantages of conventional grinding(CG) and Ultrasonic machining(USM), resulting in lower grinding force, better surface quality and longer tool life than that obtained by either CG or USM. So UAG is considered as probably the most frequently used machining method for advanced ceramics. Brazed diamond grinding wheels, which has high binding strength and exposure height, has different grinding performance with other conventional grinding wheels. UAG test on Si C with defined grain distribution brazed diamond grinding wheel was conducted in this paper and some research was made. The main creative contents in this paper are as follows:(1) Force test on Si C was conducted and the influence of ultrasonic vibration and grinding parameters on grinding force and force ratio was studied. The force character of brazed diamond grinding wheel was illustrated through the comparison with sintered grinding wheel.(2) Surface integrity test on Si C was conducted and the influence of ultrasonic vibration and grinding parameters on surface roughness and surface topography was studied. The grinding surface character of brazed diamond grinding wheel was illustrated through the comparison with sintered grinding wheel. The relation between undeformed chip thickness and materials removal mechanism was studied though surface damage and specific grinding energy. And the relation between undeformed chip thickness and subsurface damage was also studied.(3) The influence of ultrasonic vibration on wear character was studied by wear test of sintered grinding wheel. The wear character of brazed diamond grinding wheel was illustrated through the comparison with sintered grinding wheel.