Research On Influence Factors Of Inorganic Adhesive Of Adhesion Of Low Emissivity Coating With High Temperature Resistant

The infrared emissivity of aircraft thermal components generally high, the main way to solve this problem is on its surface coated with a layer of low emissivity coating with high temperature resistant.The pigment of low emissivity with high temperature resistant was mainly researched early, and the low emissivity coating with high temperature resistant of the emissivity in 3~5μm as low as 0.277 in600℃ was prepared.But the adhesive force of prepared coating is so poor. So, in this paper, in order to solve the problem, the adhesive of low emissivity coating with high temperature resistant was screened in theory and experiment, and the filler content, curing temperature and module of adhesive were changed. The inorganic silicate binder with best adhesive force performance at last was chosen.The obtained research results were as follows:1. The binder of low emissivity coating with high temperature resistant was selected by theory and the inorganic silicate binder was determined lastly according to the analysis of Arrhenius formula.2.Through the analysis of coatings prepared by different modulus silicate inorganic adhesive on the market and the pigment of low emissivity with high temperature resistant, eventually it can be learned that the modulus of silicate inorganic adhesive with better adhesion with the substrate is in the range of 1.6 to 3.7. Therefore, inorganic silicate binder of this range should be chosen to ensure good adhesion of coating and substrate.3. Through the preparation of coating, made up with silicate inorganic adhesive of the modulus of3.24 and the pigment of Ce O2, and the change of content of filler, observing the situation on the surface of the coating,it can be founded that the solidification process of inorganic silicate binder is the process of moisture evaporation and when the filler content is too small, the coating will be blister defects, only when the filler content in the coating 70%, foaming phenomenon solved, and the coating hardness and adhesion best. Furthermore, the addition of filler not only solved the foaming phenomenon of the inorganic adhesive in the process of curing, but also gave the performance of the low emissivity of coatings.4. Choosing the silicate inorganic adhesive of four modules in the range of 1.6 to 3.7, fixed filler content 70% and change of modulus and the curing temperature,it can be concluded that when the modulus of inorganic silicate binder is 3.24, filler content 70%, and the curing temperature is 200 ℃,the adhesion of coating on high temperature alloy plate is the best. After the heat resistanceperformance test in 800 ℃for 4h, the adhesion also maintain the best level, solving the poor adhesion performance of the coating on substrate.5. The paper also made the bonding mechanism inorganic silicate adhesive and the substrate perfect.