Temperature Analysis In The Process Of Silicon Slicing Using Wire SAW

Wire saw is the main slicing technique for silicon crystal, including free-abrasive wire saw and fixed-abrasive wire saw. Temperature variation during slicing can cause bow and warp on silicon ingot, therefore, it is important to control the temperature during silicon slicing. Based on the previous research, temperature analysis in the process of silicon slicing using different wire saw is studied and compared through both simulation and experiment. The primary works in this paper are presented as follows:1. The existing research of temperature variation during wire saw is summarized, on the basis of which, the temperature variation of the slurry along wire traveling direction and slurry-silicon temperature distribution is analyzed and compared through simulation and the temperature variation of the silicon along wire traveling direction is studied and compared through both simulation and experiment.2. Simulated temperature analysis in the process of silicon slicing using different wire saw:GAMBIT is used to establish and mesh the module of the free-abrasive wire saw and fixed-abrasive wire saw, and then FLUENT is applied to set various boundary conditions and simulate the temperature of fluid-solid coupling system of slurry and silicon during different silicon slicing and the temperature variation of the silicon and slurry along wire traveling direction.3. Experimental temperature study of silicon slicing using different wire-saw: temperature-measured experiment platform during silicon slicing is created, the silicon temperature along the wire direction sliced by free abrasive wire saw and semi-fixed abrasive wire saw is measured and compared.