Study On The Ultrasonic Assisted Grinding Process Of Ceramic Tile

In production of ceramic tile,edging is essentiall operations.There exist shortcomings such as large energy consumption、low efficiency and heavy wheel wear in the traditional mechanical grinding.Ultrasonic composite grinding not only can retains the characteristics of grinding,but also can improve processing efficiency,reduce cutting force,at the same time can reduce the cutting temperature and wheel wear, also can improve the broken area of the tile.Comparative experiments of grinding Al2O3 ceramics with/without vibration were carried out on the he ultrasonic grinding device.In this paper, selecting certain grinding process parameters and grinding modes, comparative experiments were carried out with electroplate diamond wheels. Analytical investigation on the grinding force,grinding temperature and broken area of the tile was carried out according to the experimental results.First, According to the motion characteristics of the grinding wheel relative to the workpie,the movement equation of the particle in ultrasonic vibration assisted grinding was established. It analyzes the trajectory of abrasive grains, and plots the track pattern through matlab, combined with the characteristics of ceramic tile edging analyzes the face and peripheral surface of the grinding wheel abrasive movement characteristics. According to the analysis of the movement of the abrasive arc length and average chip cross-sectional area,it showed that:with the help of ultrasonic motion arc of the abrasive become longer, chip cross-sectional area getting smaller.Second, It introduces and analyzes the overall experimental apparatus. It focuses on the specific composition and the main function of ultrasonic power, introduce the structure and size of the the ultrasonic vibration system and improve the mechanical structures.it improve the rigidity and stability effectively.Third, the experiment was done about the ultrasonic assisted grinding in ceramic tile. Compared ultrasonic assisted in tile edging and common grinding about the influence of spindle speed, feed rate, grinding depth in grinding force, grinding temperature, ceramic tile chipping area. The results show that ultrasound-assisted action can effectively reduce the grinding force, lower grinding temperature, reducing the chipping area. At the same time, by orthogonal experiment, it study the influence of spindle speed, feed rate, depth of grinding, ultrasonic voltage on the grinding force, grinding temperature, the chipping area, and draw the best combination of processing parameters. According to the results of,xial grinding force,it established the empirical formulaof axial grinding force, which can predict the xial grinding force in different processing parameters, it has the guiding role in predicting the axial grinding force...