Manufacture And Examination On The Ultrasonic Assisted Grinding Instrument Of Ceramic Tile

The grinding process of ceramic tile plays a very important role in the production of ceramic tile.The current processing method is mainly traditional grinding,but it has low efficiency and high energy consumption.Ultrasonic assisted grinding is a combination of ultrasonic processing and traditional grinding,and the advantages of these two processing methods are fully utilized,making this processing method more efficient,less energy consumption,and less environmental pollution than traditional grinding.This paper mainly makes trial production and research on ultrasonic assisted grinding tool,and proves that ultrasonic assisted grinding has more advantages than traditional grinding.The main research contents include the following aspects:First,According to the mechanism of ultrasonic generation and the kinematics law of ultrasonic propagation,the general solution of the particle motion is solved from the wave equation of ultrasonic wave to analyze the general law of ultrasonic propagation.The energy distribution and energy conservation conditions of ultrasonic propagation are also studied.Through the understanding of the propagation characteristics of ultrasonic waves in metal materials,the relative changes of stress and strain of metal materials under the action of ultrasonic waves are analyzed,and the phenomenon of transmission and reflection of ultrasonic waves on the interface of metal materials is also understood.This phenomenon may cause energy loss in the process of ultrasonic transmission,which provides a theoretical basis for the design of ultrasonic assisted grinding tools.Second,the structure design of ultrasonic assisted grinding tool is mainly designed ultrasonic transducer,amplitude change bar and tool head.Based on the characteristics of ultrasonic generation and propagation,the technical parameters of ultrasonic vibration system suitable for practical grinding are designed,and the machining dimensions of ultrasonic assisted grinding tool are calculated.Thirdly,the ultrasonic assisted grinding tool is tested and verified to verify whether it conforms to the idea.The main tests include:(1)finite element simulation tests,whichmainly model and dynamically analyze the designed geometric parameters,and also verify that the design meets the requirements of ultrasonic vibration.Ultrasonic vibrations are generated at the tool head position and the amplitude is the maximum.(2)Impedance analysis test,which mainly verifies the impedance test of a sample that has been designed and processed,and analyzes its basic ultrasonic technical parameters,including resonance frequency,anti-resonance frequency,dynamic reactance,mechanical quality factors,and mechanical coupling coefficient.Through the analysis of the obtained characteristic curves and the technical parameters of the test,the design meets the requirements of ultrasonic vibration and achieves the requirements of optimization.(3)The actual processing comparison test,the sample of the ultrasonic assisted grinding tool manufactured is installed on the test platform,and the processing test is compared with the traditional grinding processing equipment,and the surface roughness is used as the evaluation basis.Based on the final test results,a graph is drawn showing that the surface quality of the ultrasonic assisted grinding process is better than that of the traditional grinding process in the same time,and that the processing time increases.The surface quality of the traditional grinding process has been reduced,and the ultrasonic assisted grinding process has not appeared this obvious phenomenon.Finally,through a series of analysis and comparison,it is concluded that the design of ultrasonic processing combined with traditional grinding process can achieve the desired results.At the same time,under the test,its actual processing characteristics are superior to traditional grinding,which also proves that ultrasonic processing has played a positive role in the practical processing field.