Structure Modeling And Simulation Of Mems Angular Vibratory Gyroscope

As an important application of MEMS technology, with the advantages of low cost, small size, high reliability and low power consumption, MEMS gyroscope has been widely used in automotive, electronics, aerospace and other fields. Many countries have taken it as one of the priority technologies must be focused.As the background presented above, an anti-overload angular vibratory gyroscope structure with high sensitivity and a bandwidth of 100 Hz was design in this paper. The driving and Coriolis moments of the structure were derived, based on which, the dynamic equations of the two operation modes were theoretically modeled. Then, analytical expressions of the mechanical sensitivity and bandwidth were obtained. The air damping of two operation modes were analyzed, and as one of the considerations, thermo-elastic loss was analyzed for the design of silicon resonator gyroscope with high Q value.Secondly, based on the ANSYS finite element analysis technology, the modal, thermo-elastic damping, air damping, high-g resistance and drive amplitude were analyzed. Simulation results showed that the structure met the designed goal of bandwidth, had a high Q value in high vacuum, and had the ability to survival in high overload without stopper. Compared with the experimental data, the results of Q value and anti-overload simulation were verified.Finally, an analytical model for gyro’s package was established by laminate theory, then, the radius of curvature of the chip from thermal stress was calculated, based on which, from the view of bonding misalignment in process, an analytical model was established for calculating the bias temperature characteristics. The comparison showed that the theoretical results fit the experimental data well, quantitative optimization of the package was also proposed.