Analysis For Temperature Field And Thermal Stress Of Resin Matrix Composites During Curing Process

Curing is one of the major manufacture and maintenance technology of resinmatrix composite components. In the present dissertation, the FEA-based simulationof the temperature field distribution of the composite laminate component and theepoxy resin under curing is performed, the thermal stress of the composite laminate iscalculated, and the optimization of the curing process and structural design is putforward according to the calculation results. The main contents are as follows:(1) Based on the heat transfer rule of composite components in the curingprocess, the cure kinetics equation is introduced into the heat conductive governingequation through the internal heat generation pattern. A three-dimensional finiteelement analysis model is developed for simulating the temperature field and thermalstress distribution of the composite component during the curing process.(2)3D unsteady numerical simulation for the temperature field of the compositelaminate component under curing is performed, and the correctness of the numericalmethodology and model is verified by comparison with the experimental results.(3) The temperature and the degree of cure of3234/T300B composite laminateduring the cure process is simulated，and the cure reaction characteristic temperaturesof the epoxy resin are calculated，and the effect of fiber on the cure reaction of theepoxy resin is analyzed.(4) Based on the node temperature of temperature field, the thermal stress ofComposite Laminates3234/T300B during curing is predicted.(5) The effects of the pre-curing time, heating rate and the stacking sequence onthe temperature field and thermal stress during curing process are numericallyanalyzed. According to the results, the optimization schemes of the curing process andstructural design are put forward.