Experimental Studt Of Heat Pipe Radiator For CPU Chip And Its Optimum Design Of Composite Structures

Modern electronic devices are increasing becoming highly integrated system formed by high-density packaging and micro-mounting. Due to the increasingly tend of miniaturized electronic equipment and devices, the size requirements for heat radiating device is more and more high. Heat pipe cooling technology has powerful cooling capacity which has reached 200W/cm2, and it has flexibility in form design and size. Compared with traditional heat sinks structure, heat pipe radiator has clear advantages, especially in computer CPU heat dissipation problems. The development and thorough discussion of electronic heat dissipation field is of great significance for technological advances in electronic information, chemical industry, new energy, high performance computers, space technology and MEMS in China.Based on the practical application of heat pipe in CPU chip thermal field, this paper designed and manufactured various wick structures for heat pipe. That is, grooved wick, sintered powder wick and composite fibers wick. Temperature acquisition program is compiled by Labview graphical language. And the purpose of the test platform is to monitor multi-channel information at the same time. Start performance and heat transfer performance of heat pipe with different wicks were tested based on the test bench. The effects mechanism and regularity of various wick structures on start performance of heat pipe were analyzed. The advantages and disadvantages of different heat pipes applied on the CPU heat sink were discussed, and sintered powder wick was the best choice after comparison.Heat pipe radiator with aluminum fins were designed and manufactured, and a test bench aimed at the radiator cooling capacity evaluation and testing was built. The acquisition unit was still compiled by Labview. The experiment was conduct by changing wind speed of cooling fan and thermal power of the simulation chip. Several temperature curves of thermal performance for radiator were made, and factors affecting heat dissipation performance and dimensional relations were analyzed. Thus experimental data and improved basis for thermal performance of cooling equipment in the field of CPU chip were provided.Optimum design and simulation of aluminum finned heat pipe radiator were carried out. As the micro-structure of polymer can increase specific surface area for aluminum finned heat sink, number of heat pipes and depth ratio of micro-structure fins were optimized via software respectively. The best structural optimization of heat pipe radiator with fins was obtained under the best cooling effect simulation.