Research On The Heat Dissipation Performance Of Copper Foam Fin Heat Sink

Copper foam has the characteristics of low specific gravity, large specific surface area. As a kind of function materials, it expected to be used for cooling electronic device. The temperature of electronic radiator has been an important factor affecting the chip development, and the cooling area of traditional aluminum fins heat sinks is limited, it is not conductive to diffusion heat to air. This article will use copper foam fins in electronics heat sinks, the impact of copper foam structure and heat pipe on heat sink cooling performance has been studied. The main achievements are as follows:1, We used polyurethane foam as precursor to prepare different porosity foams, from 10 PPI to 20 PPI. The process included pre-treatment, plating, electroplating, sintering and heat treatment. The crafts of copper electroplating were: CuSO4?5H2O(200g/L), HO(CH2CH2O) n H(0.03g/L), H2SO4(60g/L), pH values(1.5), electric current(12A), plating time(10h). The thermal conductivity, compression and bending, morphology surface properties have been tested after the preparation of the copper foam. In addition,thick copper foam has been prepared.2, We used copper foam material as heat sink fins, the cooling performance of the copper foam heat sink at 80 W heating power conditions were analyzed and compared, results show that the pressure drop of 10 PPI copper foam during the experiment be less than 20 PPI, the 20 PPI copper foam heat convection strength is greater than 10 PPI copper foam, thermal resistance contrary. While the temperature field and flow field at different air velocities are recorded during the experiment, we found that the copper foam skeleton plays spoiler role, the structure of the copper foam has the effect of promoting heat dissipation process.3, The heat dissipation of the four aluminum fins heat sinks at different heating power conditions have been studied, and calculated heat sink cooling capacity, pressure drop and friction coefficient, temperature distribution and thermal resistance, etc. Data was analyzed obtain that thinner substrate heat sink has the best heat dissipation performance at the same conditions, the most uniform temperature distribution of the four heat sinks is the heat pipe heat sink, the maximum equilibrium temperature between the heat pipe heat sink and thinner substrate heat sink at the same condition is only 5℃, the quality of the heat pipe heat sink is 60% thinner than the other heat sinks.