| Copper foam with a 10 PPI linear pore density was used to enhance convective heat transfer from a heat sink in which the foam only partially filled the airflow channel. During initial tests with a 100 W heat input, and 6-7 CFM airflow rate, it was found that bonding together two pieces of copper foam with the same geometry provided worse heat transfer compared to a single foam layer. However, improved heat transfer was obtained when smaller pieces of foam that did not completely cover the first layer were added. Next, a heat sink made by solidifying molten tin around copper foam was tested at varying heat inputs and flow rates. The results were compared against tests performed on a heat sink made by soldering copper foam. The new fabrication method using tin was found to provide better heat transfer at a given pressure drop compared to soldering. |
