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Molding Analysis And Optimization Design Of The Bumper Based On Moldflow Software

Posted on:2016-08-02Degree:MasterType:Thesis
Country:ChinaCandidate:Y J QiFull Text:PDF
GTID:2272330482468067Subject:Materials engineering
Abstract/Summary:PDF Full Text Request
Compared with traditional mold design, the design with Moldflow software technology, can be found problem in the early stage, and can short development cycle and reduce production cost, so as to enhance core competitiveness of enterprises.By using Moldflow software, the gate number of bumper influence of the filling time, welding line distribution, the flowing front temperature, distribution of cavitation, shrink mark index and warpage is analyzed. The gate location is optimized in the scheme of 5 point gates and the scheme of 6 point gates is adopted.Simulation results show, in the premise of the same process parameters, with the increase of the gate numbers, the filling time decreases gradually, from 4.1 s of 3 gates forms to 3.29s of the optimization scheme, the position of the weld line is mainly concentrated at the edge of the plastic parts, the amount of weld increase with the increase of gate numbers. the temperature difference in the flowing front is gradually reduced from 8℃ in the 3 gates form to 5.4℃ in the optimization scheme, the cavitation position and weld line distribution is basically the same, the shrink mark index is increased from 2.99% in the 3 gates form to 6.315% in the 5 gates form, the total amount of warping deformation is greatly reduced.
Keywords/Search Tags:Moldflow, bumper, optimization, process analysis, Warping deformation
PDF Full Text Request
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