With the approach of the information age, massive information storage,dissemination and exchange are profoundly changing the ways of human life. Wemust pay attention to the national information security and personal privacy while westrongly pursue high performance and high speed of the devices. As the core ofinformation storage and communication devices, memory has become an importantsource of information theft and data analysis for attackers. Therefore, the securestorage of the information is a hot area of the related research field now. Besides,domestic independent research on the anti-attack technologies of secure storage canprovide powerful guarantee for the national defense security and militaryconstruction.Taking the background into consideration, this paper introduces means of attack,and mainly studies the security protection against attacks of memory chip and securestorage system with low power consumption. The paper analyzes the commoncharacteristics and puts forward corresponding protective mechanism. Using themultilayer ceramic packaging technology, the encapsulation body or its internalsensor network is designed and implemented for security packaging integrity. Basedon the temperature characteristic and photosensitive property of semiconductordevices, sensors are designed to detect the environment variables of memory chips. Inaddition, the miniature high temperature lithium thionyl chloride battery is embeddedin this system and a RC oscillator is designed for extremely low power consumption.To make sure the sensing chip works effectively for a long time, this system containsdormancy circuit based on the oscillator. As the temperature deviation of bandgapreference will affect the accuracy of the whole system, this paper also introduces thereference circuit with a second-order temperature compensation.A high performance security chip of sensors, implemented in a standard GlobalFoundry0.18μm CMOS process, is presented. The results of temperature, visiblelight and packaging integrity are given with experiments. The temperature coefficientis-4.47mV/oC with good linearity. The oscillator achieves a frequency of30.74kHzand consumes170nA. Dormancy circuit generates the duty ratio of1:4dormant signals. In the test temperature range of-55oC to125oC, security chips can achievethe goals of detecting temperature, visible light and packaging integrity. |