| Integrated circuits (IC) is the key to the electronic information industry and has a high contribution to the development of the national economy. Every one yuan IC output can drive GDP100Yuan. The development of IC relies on high-quality bonding wire and the demands to the processing technology of hard brittle materials become higher. Ultrasonic machining is an important part of hard brittle materials processing technology which plays an important role in the manufacturing process of the IC lead dies. However, the hole of IC lead dies is very small and there is currently no proven horizontal ultrasonic machining equipment with online monitoring to make it.From this perspective, this paper studies on IC precision lead dies ultrasonic machining technology, including the following entries:I. Select a piezoelectric ceramic material with a large mechanical quality factor and a small power loss tangent. Design and manufacturing a special, high-resonance-frequency, reliable piezoelectric transducer integrated acoustics, electrical, mechanical theory.2. Analysis stepped horn with theoretical analytical method. Obtain a variable cross-section rod vibration equation. Achieve modal analysis and harmonic response analysis on ladder-type horn using ANSYS software. Optimize and verified the stress concentration in the presence of harmonic response analysis.3. Design and manufacture special ultrasound machine tools on the basis of the studies of ultrasound transducer and horn. Give a detailed analysis of the machine and divided the main structure into three parts. Calculation verification, design and manufacturing a horizontal ultrasonic machining equipment with online monitoring used for IC precision lead dies machining.4. Design orthogonal with three factors and three levels to analysis the results of ultrasonic machining. Study the actual impact and the law of grit, rotational speed and abrasive concentration on material removal rate (MRR). |
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