Finite Element Analysis And Parameters Experiment Of Bonding Process On Wire Bonding Machine

The application of microelectronic products is more and more wider. Packaging process is an important part of the microelectronics technology. Wire bonding realizes the internal electrical connection of package. The technology of wire bonding develops sustainability to adapt to the higher requirements on microelectronic packaging. The bonding parameters vary and affect the forming of the bonding interface directly. Therefore, the bonding stability and bonding quality are determined by bonding parameters. This thesis aimed at the first bonding point of bonding process to research effect law between bonding process parameters and the bonding quality. LS-DYNA is used to establish finite element model of solder ball deformation process on bonding interface. Analysis of the interface failure form and the relationship between the capillary approach speed and the impact force provide reference for setting bonding process parameters reasonability. This thesis mainly researches the following contents:1. This thesis ascertains the background and significance of this research, investigates the research status of influence rule between bonding process parameters and welding quality. This thesis aims at the requirements of the first bonding point shape, and research the effect law between bonding process parameters and bonding interface forming.2. Using the method of orthogonal experiment to set a reasonable combination of multiple parameters in different levels. Study how the bonding parameters combination which include temperature, capillary head approach speed, the bonding pressure and the ultrasonic vibration effect law on the final weld shape ball size and the bonding quality.3. In view of the difficulty to get bonding interface deformation process detailedly in the experiment, using the finite element software to simulate the overall deformation of the golden ball and bonding pad in bonding process. And get the distribution and change rule of stress and strain in bonding process. These results provide theory to avoid stress concentration and support for welding plate structure design.4. Based on the analysis of the bonding interface failure forms, building the finite element model of golden ball and bonding pad to simulate the impact process, to research the relationship between capillary approach speed and impact force. The analysis results provide reference for setting bonding process parameters reasonability.