| Piezoelectric inkjet printing technology is widely applied for its advantages,such as economic, durable, efficient and high resolution. The technology has been to the microelectronics manufacturing,micro optical components production,microelectronic packaging, and other industry development. At the same time, the injection material of this technology is not only confined to the ink now can also be used for silver pulp, and the photoresist injection. Now the technology has been monopolized by foreign countries so many domestic scholars have conducted research in this area.Now the main producing method of chamber are sacrificial layer method and the bonding method, but due to the small size of the interior of the chamber, the sacrifice layer materials is difficult to discharge. Bonding method is to do with the structure of the cover and then to bond, so it increases the difficulty and cost of bonding In this paper, we use the improved thermal bonding method to produce a low-cost chamber. The main research content is as follows:(1) Put forward an improved thermal bonding method which can effectively solve the problem of sag in the process of bonding. Firstly, we use the process of the MEMS photolithography process to obtain an open structure of the inkjet chamber. Then bond a layer of SU-8 film about 10μm. After the lithography,we spin coating a layer of SU-8 adhesive then the bonding is finished. At the same time, we analyzed the bonding pressure, the bonding temperature and the bonding time which influence the bonding rate and the bonding strength. Compared with other methods of bonding, it is not easy to appear sag in the process of bonding, and the bonding rate and the bonding strength is higher. This can provide a new method of process for low cost and high bonding strength microchannel.(2) Application of oxygen plasma to process chamber surface can improve the surface energy of the SU-8 and improve the bonding strength. The surface energy of the cured SU-8 is low and therefore the bonding glue is easy to fall off when developing. The oxygen plasma treatment can increase the invasive of SU-8 surface which can enhance bonding strength. At the same time, we designed the bonding fixture with which the size of the bonding pressure can be controlled through air pressure. Also the fixture increases the force area during bonding process. With the bonding fixture in the process of bonding can impose uniformity bonding pressure on the bonding surface, so the bonding rate and the bonding strength have a very big improvement.(3) Research the factors which affect the quality of inkjet hole. In this paper, the basal surface is more complex, so the diffuse reflection occurs during the exposure. The reflected light can make the SU-8 in the inkjet hole location exposured, which affects the quality of the inkjet hole. Through experimental analysis antireflective material AZ Baril-Ⅱ can absorb all the incident light to eliminate the influence of the reflected light. Using reflective materials AZ Baril-Ⅱ in the basal makes inkjet hole quality improved. And in the process of bonding because of the effect of bonding parameters will cause the sag of bonding layer, so in the process of exposure, in the position of the bonding layer the total reflection makes inkjet hole exposured that affects the quality of inkjet hole. Therefore we studied the best bonding pressure, the bonding temperature and the bonding time to eliminate the sag of bonding layer.(4) Finally, in this paper ink drop test is carried out on the experimental platform, which verifies the rationality of the structure, and provides help in our optimization and later research production. |
PDF Full Text Request