The Research And Analysis Of Electromagnetic Properities Between Mcirowave Multilayer Circuit Layers’ Interconnect Structure Under Complex Conditions

With the miniaturization and high speed of microwave integrated circuits,multilayer circuit boards’ interconnect simulation technology have become more and more important for board-levels’ circuit design and signal integrity analysis, use the unmixed numerical calculation and commercial simulation software for the study of complex multilayer interconnection structure can not meet the accuracy and speed’s requirements of the electromagnetic analysis field’s research. Based on microwave network, electromagnetic field theory, elecmagnetic numberical calculation method, the paper studies microwave multilayer circuit layers’ interconnect-structure under complexconditions by making following experiments:Build the physical model of the complex microwave multilayer circuit dielectric board, then divide the structure into internal structure and external structure according to its structural features, the internal structure contains a large number of vias and striplines, research the internal and external structures’ analytical methods and factors, respectively. Finally, use the mixed analysis method achieving the compelte via structrues’ analysis.Choice the matrix-penciled method analysis the external structure of vias, choice RWG function as the basic function and generate the corresponding triangle mesh bin, applicate the method of moments to solve the external structure’s surface current distribution, then the main modes of the current density destribution is obtained by using the matrix-penciled method, and at last obtain the external structure’s scattering parameters.Applicate intrinsic circuit model to build the vias’ internal structure’s model, introduced via intrinsic three-port network circuit model and five-port network circuit model and analyzed the three-port network circuit model and the five-port network circuit model, studied the parallel-plate impedance’s introduction under complex conditions and using the boundary integral equation method to solve via’s internal structure ‘s impedance of the parallel plate with comlex boundry conditions.Choice the recursive admittance parameters cascading’s method to achieve internal structure’s cascading between layer and layer of the vias, and then using scattering parameters cascading’s method to solve the whole structure’s scattering parameters.Finally, validating the via’s external structure,internal structure and the whole structure’s analysis method’s feasibility and errors through HFSS simulation software’s simulation results and then use the method to analysis the via’s transmission affected by key parameters and the law of signal transmission between the via holes.