Research On Microembossing Process Of Using T2 Copper Corrugated Plate

In recent years,the Industrial 4.0 era brings new opportunities and challenges to the world.However,industrial robots and internet equipment,as the core of Industrial 4.0,require a large number of electronic products and components.It can be foreseen that the demand of micro-parts,as an important component of electronic products and components,will rise sharply in the future.However,in many micro-parts manufacturing technology,plastic micro-forming has been widely used for its low cost,high efficiency,good precision and superior quality.In plastic micro-forming,when the thickness of the foil is reduced to less than 0.10 mm,due to the limitation of foil thickness and the size effect,the forming characteristics are different from traditional forming.Therefore,in this paper,the simulation and experiment of T2 copper corrugated foil are carried out and the springback regularity of foil under microscopic scale is studied,and the high quality corrugated sheet parts are formed on this basis.In this paper,T2 copper foil with thickness of 0.02 mm to 0.10 mm was used as experimental material,the mechanical properties of T2 copper were studied by tensile experiment.The results showed that under the same heat treatment process,the different thickness of foil exhibits two different size effects.When t≥04mm,the foil exhibits the size effect of “the smaller the weaker”.When t=0.02 mm,the foil has a size effect feature of “the smaller the stronger”.To simulate the process of micro-molding and springback of corrugated sheet,Abaqus numerical simulation software is used.The results show that the equivalent plastic strain of corrugated foil increases with the increase of blank holding force,Maximum equivalent plastic strain occurs at the peak of wave and the flange.With the increasing of the thickness of the corrugated foil,the thickness reduction is mainly concentrated at the trough of wave and the middle trough is the most serious.Springback of the corrugated foil decreases with the increase of the blank holding force,the thickness of the foil and the heat treatment temperature.The experiment to form the T2 copper corrugated foil was carried out at room temperature.The results show that the forming of corrugated foil with blank holding force can effectively reduce springback.With the grain size increases,the springback is gradually reduced.Compared with the case without heat treatment,springback of the foil is significantly reduced.Meanwhile,it was found that when t ≤ 0.04 mm,the measurement value of springback angle shows obvious dispensability induced by size effect.Springback increases with the increase of forming speed,but the overall change is not very obvious.The angle between the corrugation and the rolling direction can also influence springback,in which the springback is the biggest when the rolling direction is 45°.The micro-molding experiment of the pressure quantity on the dimension precision of the corrugated plate is carried out.By comparing the amplitude,wavelength and surface quality of parts obtained with different forming pressure,the paper optimizes technological route of T2 copper corrugated foil forming,e.g.,with heat treatment temperature of 520℃ and dwelling time of 120 min,T2 copper foil with thickness of 0.10 mm,in the punch speed v=0.10mm/s,the amount of pressure h=1.464 mm,the corrugated foil parts can be achieved with a high dimensional accuracy,good consistency and uniform thickness.