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Numerical Simulation On Heat Transfer Process Of Chamfered Mold Copper Plate

Posted on:2016-05-17Degree:MasterType:Thesis
Country:ChinaCandidate:F F RenFull Text:PDF
GTID:2311330470962865Subject:Iron and steel metallurgy
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The slab corner transverse crack has been a major problem plagued the metallurgical workers, but the chamfered mold technology can effectively solve this problem. In the chamfered mold research, the longitudinal corner cracks, mold life and water holes fouling are the three key issues plagued the development of chamfered mold. However, the three problems are closely related to heat transfer process of chamfered mold.This dissertation mainly investigated chamfered mold developed by CISRI,the three-dimensional finite element model of chamfered mold heat transfer process is established for simulating the heat transfer process of right angle mold different types chamfered mold, the optimal design of chamfered mold inclination angle and the actual heat transfer characteristics of chamfered mold. The main conclusions are as follows:Comparing with right angle mold, chamfered mold corner temperature has been hugely enhanced, and corner temperature increase by about 60?.2 holes 1 trough chamfered mold cooling effects is better than 3 holes chamfered mold and 3 holes 1 trough chamfered mold in this three different type chamfered mold.The maximum temperature of the chamfered surface is increasing with the chamfered angle increasing, and the both changes linearly. To 3 holes 1 trough chamfered mold,when the chamfered angle is increased from 22° to 45°, the maximum temperature of chamfered surface increases from 275? to 342?, and when the chamfered angle increases 1°, the maximum temperature of chamfered surface will rise about 2.9?. To 2 holes 1 trough chamfered mold,when the chamfered angle is increased from 22° to 45°, the maximum temperature of chamfered surface increases from 271? to 338?, and when the chamfered angle increases 1°, the maximum temperature of chamfered surface will also rise about 2.9?. With chamfered angle increasing, chamfered mold hot surface maximum temperature is rising,coating abrasion is weakening, and the longitudinal corner cracks occurrence probability is increasing. The six different types of chamfered mold, the maximum temperature of water hole wall and tank wall is less 130?, nucleate boiling does not occur, but the chamfered angle bigger,the more easy to scale formation.From the meniscus 0-300mm, narrow face transverse temperature distribution is 'W-shaped', which is different from inverted'U-shaped'temperature distribution of right angle mold. From the meniscus 300-800mm, the corner temperature decreases rapidly, temperature field distribution become inverted'U-shaped', which is consistent with right angle mold temperature field. Wide face copper temperature field is approximate'bow' type, which is consistent with wide face copper of right angle mold, corner temperature is lower, intermediate temperature is higher.
Keywords/Search Tags:chamfered mold, heat transfer, copper temperature field, heat flux, numerical simulation
PDF Full Text Request
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