Research On Performance Of Ni-Cu-P Alloy Plating On The Surface Of Piezoelectric Ceramic

Electroless plating has been one of the important means to achieve more functional material,with its craft simple easy to operate, electroless copperplating layer with a strong binding force and good corrosion resistance.Electroless plating process nearly non-toxic harmless as well as the characteristics of low carbon has attracted more and more people's attention.Piezoelectric ceramics not only has special piezoelectric properties, still has the pyroelectric effect, photoelastic photoelectric effect and many other characteristics, widely used in everyday life as well as in some high-end industry. Using electroless plating method, can plating good performance of metal coating on surface of piezoelectric ceramic that is helpful for the application of subsequent development of piezoelectric ceramic.Based on the piezoelectric ceramic PZT-5, the main research contentsare: Optimization process of the electroless Ni-P binary alloy plating on the surface of piezoelectric ceramic.Research on performance of Ni-Cu-Palloy plating on the surface of piezoelectric ceramic.Formula and conditions of the process that electroless plating of Ni-P alloy on surface of piezoelectric ceramic obtained by single factor experiment: Ni SO₄·6 H₂ O 30 g/L, Na H₂PO₂·H₂O 30 g/L, C6H8O7·H₂O 12 g/L, C2H9 Na O5·3H₂O 12 g/L, H3BO3 8 g/L, p H = 6.5⁷, temperature is 45⁶0 ?. Study the affect of three coarsening of 30% Na OH solution ?30% Na OH + C2H8N2 and 30% Na OH + C12H₂5SO₄ Na, acid or alkali of plating solution, additives on thedeposition rateand performance of the plating.The experimental results show that the coarsening fluid composition of 30% Na OH + C2H8N2, chemical copperplating speed is higher, the performance of the coating is better.Theplating is full dense and smooth,the corrosion resistance much better under the condition of acidic solution.Study the effect of four kinds additives of KI?Cu SO₄?HO?CH₂CH₂O?n H?C₃H₆O₃ on chemical copperplating lactate speed?the SEM images of the apparent morphology, and the corrosion resistance of coating.The results show that adding suitable amount of additive, can improve the electroless deposition rate and the performance of the plating. Deposition rate is higher andsurface of the plating is more fine and smooth,when adding 30 g/L HO?CH₂CH₂O?n H.The best formula and conditions of the process that electroless plating of Ni-Cu-P alloy on piezoelectric ceramic surface obtained byorthogonal experiment method:Ni SO₄·6H₂O 35 g/L,Cu SO₄·5H₂O 1.0 g/L, Na H₂PO₂·H₂O 30 g/L, C₆H₅ Na₃O₇·2H₂O 40 g/L,C2H9 Na O5·3H₂O 20 g/L, p H=8, the temperature is 80 ?. Exploration research the influence of process conditions p H?6⁹?, temperature?40 80 ??, the composition of plating solution concentration of Ni SO₄·6H₂O?15⁴5 g/L?? Cu SO₄·5H₂O?0¹.5 g/L??Na H₂PO₂·H₂O?10⁴5 g/L??C₆H₅ Na₃O₇·2H₂O?20⁷0 g/L? to the chemical copperplating speed and performance of plating. The result shows that p H between 8⁹, for 60 80 ? temperature range, Ni SO₄·6H₂O concentration in the range from 25 to 35 g/L, Cu SO₄·5H₂O concentration range of 0.5¹.0 g/L, Na H₂PO₂·H₂O concentration range is 25³5 g/L, C₆H₅ Na₃O₇·2H₂O concentration range in 40⁶0 g/L, chemical copperplating speed is higher, the coating with good performance.Through the coating surface morphology and composition analysis, phase structure, corrosion resistance, electrical conductivity and hardness of the coating to compare the performance of Ni-P and Ni-Cu-P alloy plating.The result shows that the electroless Ni-Cu-P ternary alloy plating is superior to the performance of Ni-P binary alloy plating.