| Materials applied to electronic packaging with outstanding properties,such as high strength,high thermal conductivity and low dielectric constant,are requesting to a higher level as semiconductor technology and the rapid development of LED industry.In recent years,ceramic/polymer composite materials have received widespread attention.In this paper,the influence of ceramic particles types,particle concentration and preparation methods on the properties of composite materials were studied.The following three part results are presented:(1)Aluminum oxide/epoxy composites were prepared using a directly mixture method,the effect of Al2O3 content on the thermal conduct properties,mechanical properties and dielectric properties of composites were investigated.(2)Aluminum nitride particles with high thermal conductivity were applied to enhance epoxy resin matrix,the effect of Al N content on the thermal conduct properties,the mechanical properties and dielectric properties of the composites were researched.(3)A new processing technique were used in preparing Al N/epoxy composites.At first,Al N green body with equally distributed particles was prepared via gelcasting.After being degreased at 600 ?,the bodies were sintered at different temperatures from 1200 ? to 1400 ? under the atmosphere protection,and porous Al N ceramic skeletons with different porosity were obtained.Moreover,higher sintering temperature resulted in lower porosity in Al N ceramic skeletons.Epoxy was vacuum infiltrated into the sintered porous ceramic skeletons to form Al N/epoxy composites followed by solidification.High Al N loadings up to 56.4 vol.% in the composites were achieved.The flexural strength and thermal conductivity of the Al N /epoxy composites were revealed to reach 152 MPa and 3.33 W?m-1K-1,respectively.This paper provides an a promising approach for fabricating high performance Al N/polymer composites applied to electronic packaging. |
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