The Key Technology Research Of Precision Circle Diamond Wire Saw Cutting

Hard and brittle materials are widely used in aerospace,military weapons,energy and other important fields due to their unique and excellent properties.The machining of high precision parts with hard and brittle materials plays an important role in the equipment,Hard brittle materials are difficult to process materials,and cutting as the first step in the production of materials,its quality will affect the subsequent process,and even affect the final working life of the product.In order to meet the requirements of high quality,high efficiency and low loss cutting of hard and brittle materials,the machining technology of hard and brittle materials was studied.The mechanism of cutting hard brittle materials based on brittle fracture mechanics theory,the indentation crack growth process,proved that the hard brittle materials can realize the plastic removal under certain conditions,and discuss the critical condition of brittle ductile transition.According to the shape,size and distribution of particles of diamond wire,a hard brittle material of diamond wire cutting geometry model,the average cutting depth of diamond wire section of single particle and single particle of actual cutting depth is calculated,and the diamond wire cutting efficiency were analyzed,and provide a theoretical basis for cutting hard brittle materials with high quality and high efficiency.According to the requirement of hard brittle material of small diameter precision plane cutting technology,machine tool development process using TOP-DOWN correlation design method,put forward high precision diamond circular wire saw HGJ-200 overall design scheme,including control device loop feed system,process,cutting machine manufacturing diamond wire cutting ring frame,constant tension.Based on the finite element analysis method of Solidworks Simulation,the static and dynamic characteristics of the key parts of the machine tool are analyzed,and the structure of the machine tool is optimized.In order to guarantee a high cutting precision,systematic research on manufacturing,assembly and measurement process of the machine,the whole assembly process of strict implementation of precision and ultra precision machine tool assembly process,according to the error distribution principle,13 geometric error analysis of circular diamond wire cutting machine exist,using RENISHAW XL-80 laser interferometer measurement method the machine,the mobile side and measuring and debugging cutting frame accuracy.Cutting equipment after the completion of the development,carry out a series of cutting experiments of hard and brittle material cutting,through orthogonal design and grey theory analysis method,obtains the different process parameters on the surface of KDP crystal after cutting roughness,flatness and its influence of side size,choose the optimal process parameters after the test,KDP crystal cutting the quality: Ra is 0.94 um and flatness is11μm;chipping size by loop line speed has significant influence within the online speed 50m/s cutting machine,good stability.The workpiece platform increases the rotating device,and the cutting quality and cutting efficiency are obviously improved in the cutting of hard and brittle materials.The cutting properties and service life of the diamond wire with different grain sizes were studied under different cutting modes.The results show that the total thickness deviation TTV of 0.7mm diamond wire cut Nd:YAG crystal is less than 30μm.