Experimental Study On Two-dimensional Ultrasonic Vibration Aided Wire Saw Cutting Process Mechanism

In recent years,hard and brittle materials,especially non-metallic,non-conductive materials,semiconductors and other materials,such as glass,all kinds of stone,precious stones and silicon crystals,their hardness,brittleness,abrasion resistance,corrosion resistance and oxidation resistance relatively high,due to these unique properties,these special materials in the military and civilian industries and other fields are more and more widely,the corresponding processing requirements are getting higher and higher.Therefore,to find a high efficiency and high quality cutting method has a very important practical significance.consolidated abrasive wire cutting technology is more effective than free abrasive wire cutting technology,with high efficiency,thin slices,provincial materials and processing surface damage and other advantages.Relevant research and experiments show that the efficiency of ultrasonic vibration cutting can be increased by about 2 to 3 times,and can improve the cutting accuracy and tool life.Therefore,this paper presents a method of electroplating diamond wire cutting based on two-dimensional ultrasonic vibration(applying a tangential ultrasonic vibration and a vertical ultrasonic vibration parallel to the tangent).In this thesis,ultrasonic vibration theory,indentation fracture mechanics,brittle plastic processing theory as the theoretical basis to study the impact of ultrasonic vibration on the trajectories of abrasive particles,analysis of critical cutting thickness,to explore the conditions of brittle plastic processing,and application of material removal mechanism from the theory proved to improve the cutting efficiency and surface quality,and the use of self-made multi-wire sawing simulator and ultrasonic vibration table for experimental verification.In this thesis,through theoretical derivation,simulation,equipment development and experimental analysis and other means,two-dimensional ultrasound assisted multi-wire sawing technology has been studied,the main work of this paper and the results are as follows:(1)The motion equation of two-dimensional ultrasonic vibration multi-wire sawing abrasive grains is deduced,and the motion trajectory of single abrasive grains in two-dimensional ultrasonic vibration is analyzed by Matlab software.The two-dimensional ultrasonic vibration line cutting is better than ordinary line cutting and one-dimensional ultrasonic vibration line cutting.(2)Based on the theory of indentation fracture mechanics and brittle plastic removal mechanism,a single abrasive cutting model of two-dimensional ultrasonic vibration multi-wire sawing is established.The critical cutting thickness of single abrasive grain is given,and the mechanism of brittle plastic removal based on the critical cutting thickness model of single abrasive grain under two-dimensional ultrasonic vibration conditions,the critical conditions of two-dimensional crisp-plastic transition are given,and the material removal rate model is established.Under the two cases,the two-dimensional ultrasonic vibration multi-wire sawing is better than ordinary wire cutting.(3)According to the ultrasonic vibration assisted multi-wire sawing of the overall program design,the selection of ultrasonic power supply,ultrasonic transducer,ultrasonic horn and ultrasonic vibration table material selection and structural design,and finally processing and make the entity assembly,for the follow-up multi-wire sawing process to prepare.(4)The simulation study of ultrasonic horn and ultrasonic shaking table is carried out.It was used to model the horn and shaker and modeled by ANSYS for modal analysis.The modal analysis was used to determine the inherent frequency,the horn by the load as a time-varying harmonic load and harmonic response analysis,analysis of the horn frequency and amplitude to determine whether to meet the design requirements.The effect of the vibration table on the vibration amplitude of the vibration table and the amplitude value of the workpiece are simulated by modal analysis of the vibration table and the harmonic response analysis.The simulation results are verified by the vibration test data.(5)Through the experimental means to study the main processing parameters(wire sawing speed,feed rate,ultrasonic vibration amplitude,etc.)and the workpiece material removal rate,surface quality,wire saw wear relationship,to explore the ultrasonic vibration of electroplated diamond saw blade sawing the impact of processing,from the summary of the laws and characteristics.In this thesis,the two-dimensional ultrasonic vibration assisted multi-wire sawing technology,both theoretically and experimentally,can effectively improve the cutting efficiency,improve the quality of surface processing,and to a certain extent,improve the life of saws,to the practical application of the project has a very important significance.