| Epoxy resin has been widely used as an insulating material in the electrical and electronic industry due to its excellent dielectric properties,stable formability,good seal ability,small coefficient of linear expansion and so on.With the rapid development of modern technology,the epoxy resin insulation performance requirements are higher and higher,such as mainly used for integrated circuit packaging materials and printed circuit boards require a specific low dielectric constant,low dielectric loss and higher breakdown field strength.This paper added nano silica and nano alumina respectively to epoxy resin by means of mechanical blending method for fabricating the epoxy resin nanocomposites with different nano content and did some relevant electric performance tests and mechanical test.The dielectric properties of materials under room temperature and variable temperature were measured by Novocontrol broadband dielectric spectroscopy.It turned out that nano alumina and nano silica which could both reduce the dielectric constant and dielectric loss of epoxy resin at room temperature and variable temperature.The breakdown strength was measured by the AC and DC breakdown equipment measurement under the direct current and alternate current.The results show that both the alumina and the silica could increase the breakdown strength of the epoxy resin at both AC and negative DC voltage.In the same amount of addition,the breakdown strength of the epoxy resin nano alumina composite was larger than epoxy resin nano silicon oxide composite material.The mechanical properties were measured by means of the sansi universal testing machine.The results showed that nano-alumina and nano-silica could increase the ultimate strength and elastic modulus of epoxy resin,and 2.5wt% was the best content of toughening effect.The dry friction and wet friction coefficients were tested by a WTM-2E controlled atmosphere micro friction and wear tester.The results showed that nano-alumina and nano-alumina could reduce the friction coefficient of epoxy resin. |