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Simulation And Experimental Research On Grinding Of Engineering Ceramics Based On Single Diamond

Posted on:2018-12-18Degree:MasterType:Thesis
Country:ChinaCandidate:H HuFull Text:PDF
GTID:2321330536987643Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
It has high requirements on forming accuracy and surface integrity in SiC grinding.Considering the hard and brittle characteristics of SiC,monolayer brazed diamond wheel,with large chip holding space and high combine strength,shows a great advantage in improving machining efficiency and reducing tool wear.At present,single-grit grinding method is usually used in the research on SiC grinding mechanism,but existing methods can not truly represent the actual grinding process.In this paper,the single grain brazed grinding wheel is used to characterize the actual abrasive particle morphology.Meanwhile,the actual trajectory of abrasive grains is simulated by controlling the grinding parameters.The influence of grinding parameters and abrasive grain morphology on SiC grinding is studied,which is significant to improve grinding surface quality and reduce grinding damage.The main research works are as follows:(1)The distribution of crack growth,stress and strain field and temperature field are studied by finite element method,and the qualitative relationship between the SiC removal manner and the stress form is established.The relevant process parameters were selected for grinding experiment.(2)Design and make single grain brazed grinding wheel.The influence of grinding speed and the maximum cutting thickness of single abrasive on SiC grinding process is analyzed.Measuring grinding force and calculating grinding specific energy.Also,surface topography and subsurface damage were observed.(3)The cutting edge radius of diamond was calculated by the least square method.Comparative analysis of the influence of cutting edge radius on the grinding of SiC.The relationship between the circle radius and rake angle and its influence on brittle transition are studied.(4)Based on the different forms of abrasive wear,the quantitative relationship between the cumulative removal of SiC ceramic material and the amount of diamond abrasive wear was established.The effect of abrasive wear on the surface quality and grinding force are studied.
Keywords/Search Tags:single abrasive grain grinding, silicon carbide ceramics, the maximum thickness of single abrasive grain, brittle fracture, plastic deformation
PDF Full Text Request
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