Effect Of The Functionalized Graphene Oxide On The Interfacial Bonding Properties Of CF/BMI Composites

The thermal residual stress,which are generated during curing process,have negative effect on interfacial bonding strength of CF/BMI composites.The TFB specimens with different content of MAH-f-GO nanoparticles were manufactured to investigate the effect of MAH-f-GO on interfacial strength of the CF/BMI composites.The coefficient of thermal expansion,cure shrinkage,Possion's ratio and elastic modulus of MAH-f-GO/BMI composites were measured and used in the FE simulation.A FE analysis model was established to simulate the thermal residual stress distribution around the carbon fibre and estimate the interfacial bonding strength of TFB specimen.Moreover,a two axisymmetric model was established based on the thermal-curing coupling model to simulate the thermal residual stress.It is found that the addition of MAH-f-GO nanoparticles noticeably reduced the concentration of residual stress on the fibre-matrix interface and enhanced the interfacial bonding stength of carbon fibre/BMI composites.The transverse strength of the TFB specimen increased by 52.5%from 36.11±1.11 to 55.07±1.31 MPa when the MAH-f-GO loading was 0.15wt%.The results of FE simulation indicate that the residual thermal stress is decisive factor for the bonding strength of the CF/BMI composites.It is also found that the thermal residual stress mainly concentrates on the regions between the carbon fibre adjacent to the BMI matrix.Compared to the neat BMI,the interfacial residual stress of BMI composite with 0.15 wt%content of MAH-f-GO decreased by 13%from 1.56×10~9 N/m~2 to1.36×10~9 N/m~2.The results of thermal-curing coupling simulation indacte that the curing rate reached the maximum at 100 min.The two axisymmetric model based on the thermal-curing coupling model can accurately estimate the thermal residual stress of composites.