The Studies On Preparation Proess, Structure And Properties Of High-silicon Aluminum Alloy For Light Weight Electronic Packaging

Electronic packaging materials used in aerospace vehicles should not only meet the basic need of low thermal expansion coefficient (TEC) and high thermal conductivity (TC), but also the need of hermeticity and strength, and lightweight is the precondition to use. High-silicon aluminum alloys used as lightweight electronic packaging material can not only realize the design of physical properties by changing the composition of alloy, but also have excellent comprehensive properties. But in our country at present, the same silicon content of Al-Si electronic packaging materials there is that can not also get the low expansion coefficient, the shortage of the thermal conductivity, the existing forming methods are still in the development stage of the laboratory, there is a lot of problem need to solve. The research goal of the topic is development preparation in electronic packaging materials used in aerospace vehicles of high-silicon aluminum alloys.The fabricating methods and forming mechanics for novel silicon-aluminum composites were investigated in this paper. The rapid solidification powder metallurgy and spray deposition for high-silicon aluminum alloy are summarized. The effects of fabrication and processing parameters on the morphology and properties were studied. According to the literature and experimental result, and puts forward the comprehensive analysis of the follow-up research, development and production of the alloy reasonable suggestion preparation technology. Spray deposition which process is behind are very promising methods to prepare high-silicon aluminum alloy and is worth of deeply researching.70%Si-Al alloy was prepared by spray deposition and hot pressing technology. And the microstructure, wettability and interfacial reactions of composites were analysis. The results show that Si grain size is only 20-40 ?m. The distribution of primary silicon forms a continuous framework and the Al phase encircles the interval of Si phase continuously. The fracture mode of the material is a mixture of tough and brittle ones. And the research literature material comprehensive analysis, research and development production high-silicon aluminum alloys determine light for electronic packaging material the best microstructure form control standards.