Hypersonic Vehicle Wing Fluid-thermal-structure Coupling Analysis

Nowadays, more and more countries view hypersonic aircraft research as each research hot spot. We can make the conclusion that hypersonic aircraft will become the focus of each country in the next generation of aircraft development by constantly test hypersonic aircraft of the United States. Its strategic significance and the civilian market value is self-evident.Hypersonic aircraft is in the environment of high temperature and high pressure.Thermal-fluid structure coupling problem in multi-physical field has always prevented the development of hypersonic flight vehicle. In this paper, ANSYS Workbench platform would be used to simulate this physical process, including the surface temperature, thermal deformation and stress of the aircraft structure, in order to provide necessary reference for the thermal protective structure of next aircraft design.Firstly, use compressible viscous ideal gas as the peripheral flow field of the wing to analyze the flow field for the wing under different Mach number from 0.5 to 6.5. Get the pressure distribution and temperature load of the wing under different Mach number, compare the change trend of the maximum pressure value with Mach number. Then build a thermosetting coupling analysis platform, apply the temperature load from the flow analysis to the wing for thermal field analysis, obtain temperature distribution of the wing, compare the change trend of maximum temperature value with Mach number. Finally, apply the aerodynamic load and thermal field temperature load produced by flow field to the wing for the statics analysis, gain the structure deformation and stress distribution. This paper also analyze the structure deformation and stress distribution which ignores the effect of temperature load under different Mach number for the wing.This article provides an effective and fast method for thermal-fluid structure simulation when hypersonic aircraft in flight process, it would have certain reference significance for multi-physical field coupling analysis.