Research And Development Of Multi Field Coupled Microscope Load Carrying Structure Measuring Device

With the rapid development of microelectronics, micro optoelectronic system, surface engineering, biological and medical materials, the application and development of the structure and devices are becoming smaller and smaller in its structure and characteristics. However, the design performance requirements of the structure and devices are becoming higher and higher, such as the manufacture of micro components, micro test parts of the processing, loading, micro displacement of the brake, micro displacement measurement and control and so on, all of them having a certain requirements on the mechanical properties of micro components. Due to the continuous miniaturization of these devices, most of the mechanical properties of traditional materials and methods are no longer applicable. Therefore, researchers develop a lot of micro tensile test equipment through their continuous efforts, but these devices mostly only reflect the relation of material mechanical properties and the change law of material micro structure of materials at room temperature, and they cannot reveal the relation of material mechanical performance changes and material microstructure under the current high temperature or temperature.Polycrystalline materials have been widely used in micro scale structures and devices today, so materials mechanical properties has important theoretical significance and application value based on the grain size of the polycrystalline silicon, and especially under high temperature or alternating temperature, its mechanics performance research has important theoretical significance and application value. Therefore, it is necessary to develop a kind of material for it can not only apply in the conventional deformation conditions, but also in the special deformation conditions, such as research of the relationship between the heating, cooling or high temperature conditions under the micro scale mechanical performance changes and material micro-structure.In order to solve the above problems, this paper developed a set of especially micro load carrying structure measuring device for the detection of micro size materials' mechanical properties, as well as the surface microstructure information of the multi field coupling. The device combine micro tensile, temperature control, imaging and data acquisition module into a integration through the virtual instrument platform, to achieve operational control of the each module, and the corresponding data acquisition processing, for the material can not only obtain mechanical property and morphology of the data in the experiment, but also of specimen temperature control.The device adopts a high precision stepper motor as the braking force:imaging and image acquisition and storage by using optical microscope and CCD coupled circuit; detecting a real-time tensile force of clamping sample by high micro cylindrical pressure sensor; using LVDT micro displacement sensor to track and measure the shape variable of micro size specimen; using PID digital control algorithm to control the temperature of the module; At the same time, the data acquisition system is studied, the principle and method of signal transformation are studied, the principle and method of data collection are described, and the design method of data acquisition system is introduced; multi field coupling micro is written to LabVIEW virtual platform load carrying determination device and control software, mainly including the micro brake module control, measurement system control, temperature PID digital servo control and other functions. Finally, using AZ31 magnesium alloy specimens make a high-temperature uniaxial micro tensile test through this device, obtained the specimen should stress and strain curve, calculated AZ31 magnesium alloy with the yield strength of 202.5MPa, tensile strength 206mpa and elongation is 0.34. At the same time, the crystal changes of AZ31 magnesium alloy specimens at 250 degrees under different time periods were obtained through the image acquisition of the imaging module. By comparing the existing test results, it is found that the results of this paper are basically consistent with the data of some research units in foreign countries, which proves the feasibility of the device. At the same time, the future of the multi field coupled load carrying structure measuring device is evaluated and prospected.