Research On The Heat Dissipation Performance Of LED Flip Chip Filament Lamp

As the fourth generation lighting products, LED has the advantages of energy saving, environmental protection, small volume, long service life and so on, it is gradually replace the existing lighting products. In order to meet the needs of the people's traditional lighting, LED light source--the filament lamp as a full ambient light arises at the historic moment, the LED filament lamp adopts transparent bracket encapsulate can achieve 3600 light, which is expected to replace the existing tungsten lamp and become the next generation of energy saving LED bulb light.In this article, we mainly study the heat dissipation performance of LED flip chip package, there are certain guiding value on the design of the filament.Firstly, we analysis the thermal resistance of LED flip filament from theory,simulation and experiment. Thermal resistance value from simulation is basically in line with the experimental test results, the former value is bigger than the latter and both of them are much larger than the theoretical calculation values.Secondly, we using ANSYS software to simulate the heat dissipation performance of LED filament lamp, the simulation results show, when using 15 chips in series on one filament, the LED filament lamp has the best heat dissipation performance; If we only consider the heat dissipation performance of LED, the support thermal conductivity at about 80 KmW)/( ?, the solid crystal layer material thermal conductivity at about 100 KmW)/( ?, the coefficient of thermal conductivity of packaging materials at about 5 KmW)/( ?, the LED filament lamp owns the best heat dissipation performance; The thickness of the support is thicker, larger width are conducive to chip cooling; under the premise of ensuring the quality of the solid crystal reflow, solid crystal layer thickness is smaller, the better heat dissipation of the chip, solid crystal the wider layer is also conducive to increased heat dissipation;Reduce the fluorescent adhesive thickness also can improve the cooling performance.Finally, we discuss with the same current, the more chips are using the higher the temperature of the filament chip, the worse heat dissipation performance of the filament lamp. When increasing the input current will induce the increasing of the junction temperature of the chip.