The Effect Of Inorganic Filler On Bonding Interface Of PEO-LiClO₄ And Aluminum Foil

MEMS bonding technology is one of the key factors of MEMS package. Anodic bonding technology is widely used in various fields as one of the key techniques for MEMS device packaging. At present, the bonding between various functional materials such as glass and silicon, ceramics and metal is realized. The polymer solid electrolyte has a great prospect in the anodic bonding technology because it overcomes the shortcomings of the glass and ceramic in impact resistance and has advantages in corrosion resistance, compactness, light weight and good plasticity.In order to overcome the disadvantages of low conductivity and poor mechanical stability of the complex formed by PEO- LiClO4, this paper mainly studied the effect of inorganic filler ZSM-5, SiO2 and Al2O3 on the bonding interface between PEO- Li ClO4 and aluminum foil. PEO- LiClO4-inorganic filler was prepared by high energy ball milling method. The effect of milling parameters on particle size and conductivity was analyzed, and the parameters of ball milling process was determined. The appropriate type and proportion of the inorganic filler were determined by measuring the powder agglomeration coefficient and the transport number of Li+, analyzing the degree of crystallinity by DSC and XRD. The optimum bonding parameters were selected by anodic bonding between PEO-LiCl O4-inorganic fillers and aluminum foil. The bonding interfaces of PEO-Li ClO4-inorganic and aluminum were observed by super depth of field microscope and SEM. And the component of the interfacial transition layer was analyzed by EDS.The results showed that the optimum milling process parameters were that the material ratio was 7:1, the milling speed was 250 r/min, and the balling time was 8 h. The optimum process parameters in anodic bonding were that PEO-LiClO4-ZSM-5= 10:1:1, PEO-LiClO4-SiO2= 10:1:2, PEO-LiClO4-Al2O3 =10:1:1, the preheating temperature was 100?, the preset voltage was 800 V, and the time was 10 min. After adding the inorganic filler ZSM-5 compared to SiO2, Al2O3, a thicker transition layer was obviously within the bonding interface, which the migration of Al, O and C elements and the chemical reactions were happened. The new material of transition layer was the key factor in the process of the bonding between LiClO4-PEO-inorganic filler and aluminum foil.