Research On Process Design Technology Of Hybrid Assembled Solid State Relays

As a new kind of high reliable contactless electronic switch,solidstate relay has been widely used in aerospace,aviation,ships,weapons and other fields.With the rapid development of the electronics industry,solid-state relays as electronic devices,the development trend is more and more integrated,As aerospace electronic machine system increasingly demand for the development of miniaturization,high performance and high reliability,using microelectronics assembly technology assembly of solid relay is applied more and more in the field of high level.In recent years,The Aerospace First Research Institute,Fifth Research Institute and Eighth Research Institute,whose key models have appeared on the mixed assembly of solid-state relays demand,increasing year by year and has gradually replaced the trend of the electromagnetic relay.In this paper,a model of Y/K grade mixed assembly of solid relay product development as an opportunity to carry out vacuum eutectic welding process and bonding process two key process design process to solve the technical problems.Firstly,based on the analysis of the technical indicators of solid relays,the process of assembly process of solid-state relays is determined.Combining with some problems existing in the current hybrid assembly process,the vacuum eutectic welding process and bonding process are determined by process analysis.Research on Process Design of Key Process of Product.Then,the vacuum eutectic welding process of solid state relay technology were studied.In order to meet the requirements of vacuum eutectic welding process,the structure of the welding parts has been improved,in order to ensure the welding quality and welding efficiency,In order to ensure the quality of welding and welding efficiency,we designed welding positioning fixture and make improvementaccording to the actual usage.In order to meet the requirements for welding,we butt welding material through the process and according to the welding structure of the solder sheet forming.We determined the welding parameters by orthogonal test and verified the determined process parameters by soldering test and compared with the traditional hand soldering process.Secondly,the bonding parameters of 125?m aluminum wire bonding and 25?m gold wire bond bonding were designed.Based on the range of the reference parameters,the optimal bonding parameters of the products were obtained by orthogonal test design method.The experiment of 125?m aluminum wire and 25?m gold wire was carried out.And the results show that the process capability index is satisfactory.Finally,the product trial was carried out to verify the feasibility of process design.After the completion of the assembly,the A group inspection and qualification test were performed to check whether the process design of the solid relay is in conformity with the technical specifications.The final results show that the solid relay process design to achieve the desired purpose,the performance of solid-state relays meet the technical requirements,to meet the supporting model to use.