Research On Vacuum Eutectic Welding Process For Hybrid Structure Relay Assembly

Vacuum eutectic soldering technology is widely used in the integrated circuit and microelectronics industries.With the rapid development of the electronics industry,the integration requirements of electronic components are constantly improving,and miniaturization,high performance,and high reliability are the development directions.Therefore,the eutectic soldering process technology is widely used in various electronic components.In this paper,the eutectic welding process technology in a certain type of hybrid structure relay is taken as an opportunity to carry out vacuum eutectic welding process technology research.The main work of this paper is as follows:According to the product structure of a certain type of hybrid structure relay,the process assembly process of the product is determined,and the vacuum eutectic welding process of the bare chip and the ceramic substrate in the output power component of the product is carried out in combination with the current level of the eutectic soldering process.Through the analysis of the plating material on the bare chip and the ceramic substrate,combined with the temperature characteristics and welding characteristics of the welded workpiece,the type of the solder piece is finally determined,and the elements affecting the quality of the vacuum eutectic welding are analyzed and tested,and the bare chip is finally confirmed.The optimum process parameters for eutectic soldering with ceramic substrates.The depth study of eutectic soldering in the assembly of hybrid structure relays is mainly to solve the welding problem between the ceramic substrate and the base power group.The vacuum eutectic welding process technology is used to solve the pollution problem caused by the welding of the hybrid structure relay when the ceramic substrate and the base group are interconnected,and finally reach the level of the clean welding process technology.Since the ceramic substrate and the base group are welded in a three-dimensional welding mode,the welding complexity is higher than that of the bare chip and the ceramic substrate.It is necessary to carry out relevant process design according to the structural characteristics of the product,and design relevant welding fixtures to ensure the welding quality and prevent welding spatter during the welding process.For the hybrid structure relay products with special package structure,vacuum eutectic welding technology was carried out to study the sealing welding process of large-profile cover and shell.Since the welding workpiece materials such as the casing and the cover plate are different,and the process is the last process of the product to complete the assembly,it is necessary to consider the thermal stress tolerance of the internal components,and it is necessary to re-select the appropriate solder piece and the corresponding welding process parameters.After completing the above process technology research,the product needs to be trial-produced to verify the feasibility of vacuum eutectic soldering process technology in hybrid structure relays.After the product is assembled,it is necessary to carry out a group inspection and appraisal test to assess whether the vacuum eutectic welding process meets the requirements of product technical specifications.The final result of the test shows that the application of the vacuum eutectic soldering process in the hybrid structure relay has achieved the intended purpose.The performance of the prototype hybrid structure relay meets the technical requirements and can meet the requirements of the model.Through the above process research,the following results were achieved:1)the void ratio of the eutectic soldering of the bare chip and the ceramic substrate is greatly reduced;2)the problem of solder contamination in the hybrid structure relay is solved by the eutectic welding three-dimensional welding method;3)the eutectic soldering process is applied to The special structure of the hybrid structure of the relay housing is sealed and welded to solve the problem of sealing of large-profile products.