Heat Dissipation Analysis And Technology Preparation Of Semiconductor Micro-cavity Laser

Semiconductor micro-cavity lasers have the characteristics of small volume,simple structure,low threshold and high Q value.Therefore,it can be used as an ideal source for large scale photonic integrated circuits and ultra large scale optical communication systems.Quantum cascade micro-disk laser has a long wavelength and simple fabrication process.It has a wide prospect in gas detection,infrared countermeasures,terahertz imaging,optical path interconnection and so on.Because of its unique cascade structure,the thermal effect of quantum cascade micro-cavity laser is very serious,which limits the development of quantum cascade micro-disk laser to a certain extent.In this paper,the thermal characteristics of quantum cascade micro-disk laser are studied,and the problem of high temperature and low power of the laser device improved.In this paper,a new inverted mount worm micro-disk cavity semiconductor laser is designed to improve the heat dissipation effect and output power of the micro-disk laser.The heat dissipation effect of the positive and inverted micro-disk laser is analyzed by using ANSYS finite element software.The simulation results show that the core temperature of the epi-side down mounter micro-disk laser is about 20 K lower than that of the epi-side up mounted micro-disk laser.The effects of In solder,AuSn solder,InSn solder and AlN heat sink on the steady-state heat dissipation of flip-chip micro-disk laser are simulated and analyzed.The simulation results show that the In solder has better heat dissipation effect.Based on this,a novel structure and corresponding technological process of the flip-chip micro-disk cavity semiconductor laser are designed.A Lima?on-shaped micro-disk cavity semiconductor laser with a characteristic radius of 90?m,120?m,150?m and a deformation factor of 0.42 has been fabricated by using InP-based InGaAs/InAlAs quantum cascade materials.The fabricated laser was encapsulated,the In solder with thickness of 3?m and 5?m was deposited on the heat sink and the effect of the flip-chip micro-disk laser was tested respectively.3?m and 5?m thick solder were deposited on the heat sink.The photoelectric,spectral and far-field measurements of 90?m micro-disk laser are carried out.The results show that the output power of the inverted micro-disk laser is about 0.8mW higher than that of the positive micro-disk cavity laser,and the output light has a good direction.