Study On Experimental Device And Measurements For Interface Thermal Resistance Of Adhesive Structure Of CFRP

Carbon Fiber Reinforced Polymer or Carbon Fiber Reinforced Plastic(CFRP)is a very high-quality composite material.It has characteristics of light weight and high strength,and has a very wide range of uses,especially in aerospace.The development of high-precision solid reflectors is imperative for China's new generation of remote-sensing weather monitoring satellites and deep space exploration satellites for high-precision reflectors.Carbon fiber reinforced plates and epoxy resins are needed.The glued structure is an important part of the high-precision solid reflector.When the reflector is flying in orbit,the thermal load is its main load,and the interface thermal resistance of the glued joint has an important influence on the temperature distribution of the high-precision solid reflector in orbital operating state.In order to effectively predict the temperature distribution and thermal deformation of high-precision solid reflectors in orbit,in order to implement reasonable thermal control and thermal deformation control,an accurate thermal analysis model needs to be constructed and the interface thermal resistance Heat transfer optimization.Firstly,according to the measurement principle of interface thermal resistance,a device was designed to measure the thermal conductivity of the monolithic CFRP structure and the interface thermal resistance of the bonded structure under different temperatures in a vacuum environment.The average measurement error is 2.01%.Secondly,for the purpose of improving the thermal conductivity of the epoxy resin,a high thermal conductivity material such as silicon nitride(?-Si3N4),alumina(A1203),graphene,etc.is added to the epoxy resin paste and then made by a special method.Into composite materials,to improve the thermal conductivity of epoxy resin.Experiments show that when a single high thermal conductivity material is added to an epoxy resin,the thermal conductivity of the epoxy resin increases to varying degrees as the added material increases.Finally,the original epoxy resin was replaced with an improved epoxy resin composite,and the interface thermal resistance of the bonded structure was measured again to verify whether the interface thermal resistance was reduced.The tensile properties of the bonded part were analyzed to observe the effect of the added material on the bonding properties of the epoxy resin.The experimental results show that the silicon nitride(?-Si3N4),alumina(Al2O3),graphene and other powder reagents can effectively reduce the interface thermal resistance of the bonding parts.