Experimental Study On Ultraprecision Lapping Process Of Sapphire

Sapphire is a widely used crystal material with good physical,optical and chemical properties.At present,it has been widely used in optics,aerospace,civil electronic products and other fields.With the increasing demand for sapphire materials,higher requirements for sapphire processing(surface roughness and material removal rate)are required.In this paper,the material removal mechanism of sapphire is studied by A and C to sapphire,and the grinding and processing characteristics of two kinds of crystal to sapphire are compared.The effect of different process parameters on the processing quality of sapphire is obtained.The damage of two kinds of crystal sapphire in the grinding process is analyzed.Form.The specific research work includes:1)The experiment of Ultraprecision grinding of sapphire with diamond grinding liquid with particle size of W2 was carried out.The effect was achieved near the nanoscale grinding process.The material removal rate under different process parameters was obtained by measurement and calculation,and the removal rate of sapphire material in the grinding process was determined by the method of variance analysis.The effect of the process parameters on the removal rate of sapphire material was investigated by single factor experiment,and the reasons for the difference in the material removal rate of two kinds of sapphire in the grinding process were analyzed.2)The surface roughness of sapphire after grinding was obtained by testing.The surface morphology of sapphire was observed by ultra field depth microscope and atomic force microscope.The surface quality difference between two kinds of sapphire was compared,and the surface crushing rate was introduced as an index to evaluate the damage of sapphire surface.Image processing of sapphire surface was processed by MATLAB.The surface breaking rate was calculated by programming.The reasons for the difference of the surface morphology between two kinds of crystal sapphire are analyzed,and the influence rule of process parameters on the surface breaking rate is explored.3)The subsurface damage of sapphire after processing was observed by cross section microscopy.The depth of subsurface damage was obtained after grinding,and the depth of the crack was used as the evaluation index of the subsurface damage depth.The subsurface damage depth of two kinds of crystal to sapphire is compared.Through the occurrence and expansion of the crack,the material removal machine of two kinds of crystals to sapphire is revealed,and the influence of the grinding process parameters on the subsurface damage depth is explored.