Preparation And Thermal Conductivity Of Functionalized Graphene Films

With the development of technology and electronic information technology to a high degree of integration,power consumption and heat dissipation have become an inevitable problem.Graphene has very good thermal conductivity,and the thermal conductivity of undefective single-layer graphene is up to 5300W/(m·K),which is the carbon material with the highest thermal conductivity so far.This paper adopts the method is simple and low cost of REDOX spin coating method for preparation of functionalized graphene films,to explore the grain size of graphene film and the way of functional factors influence on film cooling performance,ultimately has high coefficient of thermal conductivity of the functionalized graphene heat dissipation thin film,and applied to microelectronic devices.Stable graphene slurry was prepared using natural flake graphite powder of different sizes as raw material after oxidation and reduction.The process parameters of preparing graphene films were optimized for the heat dissipation performance of graphene films.The graphene film assembled by vacuum filtration allows the formation of highly aligned nanostructures that facilitate the relatively high thermal conductivity of graphene-based membranes in the plane.The larger the grain size of natural flake graphite material,the higher the thermal diffusion coefficient and thermal conductivity of the prepared graphene film.The reason is that the larger the grain size,the contact between the layers and defects will scatter phonons and increase the heat dissipation performance.Functionalized graphene oxide can be hydrolyzed with graphene oxide by functional reagent,so silanol group can be introduced.Functionalized graphene films prepared by spin coating method and thermal physical properties of its organizational structure characterization and preparation technology was studied and the influence on the functionalization of graphene oxide catalyst,found the addition of appropriate amount of catalyst were functional area has a certain role in promoting.To explore the preparation of functional films amount of spin velocity,spin coating and heat treatment on the influence of the functionalized graphene films,graphite functionalization of graphene film best preparation process for the preparation of spin speed 200 RPM,functional reagents amount of spin 20m?L,heat treatment temperature of 50 ?.On functionalized graphene films and graphene films characterize the microstructure and properties of thermal conductivity contrast,functionalized graphene films than more bend the layered structure of graphene films,FT-IR,RAMAN,XPS analysis confirmed that the introduction of functional groups.The results of heat dissipation characterization show that compared with graphene films,functionalized graphene has better thermal conductivity,with longitudinal thermal diffusion coefficient and thermal conductivity of 1275.07W/(m·K)and 2.48W/(m·K)respectively.The increase in thermal conductivity of graphene films through silane functionalization is mainly due to the strong bonds of graphene groups which enhance the interfacial heat transfer and limit the cross-section phonon scattering.Finally,the heat dissipation effect of functionalized graph ene film on the silicon wafer simulator is tested,which shows that the functionalized graphene film has a promising application in the field of electron device heat dissipation.