Research On Multi Wire Grinding Method Of Super-hard Materials

Super-hard materials have been widely used in the fields of information,mining,aviation due to its unique physicochemical properties,but the processing is more difficult to limit the further development.It is urgent to solve the problem of high efficient processing of hard-brittle materials.In response to these problems,this paper proposes a new multi-wire grinding processing.Multi wire grinding form a wire belt with a fixed abrasive diamond wire in the space and form a wire belt under the support of the auxiliary mechanism or under the action of itself,so as to make contact and relative movement between the wire belt and the processed parts,and achieve a continuous grinding.This method increases the processing method of hard and brittle materials,and provides new theories and new ideas for the processing of super hard materials.Multi-wire grinding has many advantages,good heat dissipation,not easy to block the cutter,high processing efficiency,low cost and other advantages with great research prospects.Main contents of the full text are as follows:Based on the research status of multi-wire cutting and grinding processing,this paper design multi-wire grinding machine tool including grinding system,cooling system,grinding wheel and bed.Research on processing mechanism,the wire and the processing process of silk thread are developed.Using ISIGHT to integrate Creo and ANSYS to optimize the geometry of the grinding wheel.Designed main technical parameters of the device.Based on the theory of grinding wheel grinding and super-hard material modeling,the grinding force model of multi-wire grinding is derived by taking the typical superhard material of engineering ceramics as an example.Firstly,summarize processing characteristics of hard brittle materials and establish loading formula is according to the relationship between grinding depth and critical thickness.This paper introduces several basic parameter modeling methods and theoretical formulae,and finally gets the theoretical formula of diamond wire grinding force.The abrasive grains were simplified as regular hexahedron.Based on the virtual lattice method,a three-dimensional model of microscopic diamond wires with random distribution of multiple abrasive positions was established.Using DEFORM-3D to research the effect of wire-moving speed,grinding depth,diamond wire diameter(corresponding to diamond particles with different particle sizes)and speed on the grinding force and grinding force ratio and analysis of the reasons.Design the control system for driving device and the wire device of multi-wire grinding machine,and the selection and configuration design of the differential tension sensor,tensioning mechanism and automatic wire arrangement mechanism.Multi wire grinding can process plane,steps,simple curved surface and so on,which can realize the ultra wide heavy processing,fill the blank of the industry and for super-hard material processing provides a new thinking and new method.It has a broad prospect of research.