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The Preparation Of Consolidated Diamond Wire Saw For The Cutting Of Photovoltaic Industry

Posted on:2015-09-02Degree:MasterType:Thesis
Country:ChinaCandidate:C Y WangFull Text:PDF
GTID:2381330491951783Subject:Materials science
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Cutting wire technology is the core technology of photovoltaic industry,which directly affects the production cost,processing efficiency and cutting quality of hard and brittle materials.As the mainstream of cutting line in processing industry today,the preparation of the consolidated diamond wire saw is critical.In this article,82A steel wire was used as substrate.First of all,copper preliminary plated in the cyanide-free alkalic system with HEDPA as coordination agent.Then,acidic copper plating technology with higher deposition rate substitutes traditional nickel-coated diamond grains to achieve codeposition.Finally,thickening of nickel plating is conducted to the preparation of consolidated diamond wire saw.By means of the appearance observation,measuring cathodic polarization curves,mechanical performance and integration testing,the impacts of diamond content in plating solution,cathodic current density and mixing strength on diamond deposition process were analyzed based on the theory of Guglielmi two-step adsorption model.The preparation technology of consolidated diamond coating by magnetization method was tentatively studied.In the process of diamond particles surface modification using chemical nickel-plated technology,the method of controlling the magnetic properties of the coating by means of changing phosphorus content of particulate surface through the pH change is obtained.Making use of SEM and EDX,the morphology of nickel-phosphorus electroless plating coating,plating phosphorus content of coating and the impact of the diamond content and magnetic field strength on diamond deposition were studied.The effects of pH value on the magnetic properties of nickel-phosphorus coating were analyzed with the help of PPMS test.The study of consolidated diamond wire saw prepared by copper-diamond composite electroplating shows that diamond particles adsorption process is divided into two steps:(1)diamond particles take the adsorption ions and the solvent membranes are weakly adsorbed on the cathode;(2)particles remove the adsorption ions and solvent membranes are strongly adsorbed in the cathode.With increasing the cathode current density and prolonging electroplating time,the amount of diamond deposition increases firstly and then decreases.The polarization curves for copper-diamond codeposition shift negatively with increasing diamond contents in the plating solution,and the current decreases at the same potential.In the range of low potentials,the cathodic current at the same potential increases with increasing the stirring rate.But it changes conversely in the range of high potentials.After heat treatment at the temperature of 200? for 2 h,the mechanical properties of consolidated diamond wire saw are improved with a maximum tensile strength of 159.7 N and 2258.8 MPa.The adhesion of the coating to steel substrate on diamond cutting wire prepared at the current density of 5-7 A/dm2 is strong.The research of the surface modification of diamond particles suggests that with increasing the solution temperatures or the pH values of the plating solution,the phosphorus contents of coating gradually decrease.Positive magnetization maximum increases with the reduction of phosphorus contents when Ni-P coating is easier to be magnetized.The study of the preparation of consolidated diamond coating by the magnetization method shows that with increasing the magnetic induction,the amount of the diamond deposition increases firstly to reach a maximum,and then decreases to stable state.The amount of the diamond deposition reaches the maximum value at B=35mT.Diamond deposition quantity increases with the increase of the diamond content in the plating solution.The deposition efficiency of Ni-P plated diamond particles is obviously improved under the effect of the external magnetic field.
Keywords/Search Tags:diamond, composite codeposition, electroless nickel plating, magnetization method
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