Mechanism And Technology Of Ultrasonic Vibration Assisted Cutting On The Surface Of Monocrystalline Silicon

Monocrystalline silicon material is hard and brittle.It is semiconducting and can conduct electricity,but its conductivity is less than that of metals.Silicon is easily miniaturized and has high strength.It is widely used in the preparation of semiconductors,microelectronic optical devices and mechanical parts.For example,in the field of micromachined,it is necessary to construct a three-dimensional microchannel and complex pattern on a silicon substrate.The machining accuracy is high,the equipment is simple and the machining is not limited by size.However,due to the hard and brittle characteristics of monocrystalline silicon,micro cracks and pits are easily produced in cutting process,resulting in the deterioration of surface quality.The vibration machining in high frequency ultrasonic vibration assisted machining can effectively avoid the occurrence of micro cracks,which provides a possibility for high quality machining of monocrystalline silicon.Therefore,this paper uses high frequency ultrasonic vibration auxiliary machining system and single crystal diamond tool to process the large cutting plastic field of monocrystalline silicon,and analyzes the mechanism of ultrasonic vibration assisted cutting hard and brittle materials.Firstly,this paperanalyzed the research status of Monocrystalline silicon processing,summarized the research progress and application of ultrasonic vibration machining technology.For example,ultrasonic vibration assisted cutting can improve the stiffness of the system,and replaced the irregular vibration of material removal by regular ultrasonic vibration,thus the quality of surface processing can be improved.Secondly,the single crystal silicon cutting experiment and linear groove experiment are carried out by using the tool tip circular arc radius 1mm blade tool.The kinematic analysis and analysis are carried out on the mechanism of ultrasonic vibration auxiliary material removal by analyzing the cutting depth,the pattern,the chip morphology and composition of the critical plastic brittle transition,and the kinematic formula is obtained.At the same time,in order to study the effect of tool size parameters on ultrasonic vibration amplitude,the influence of cutting depth,cutting speed and ultrasonic vibration amplitude on the quality of microgrooves cut by single crystal silicon is compared by experiments.Finally,the microstructures of monocrystalline silicon were processed with better parameters,and made the complete cross grooves and rectangle boss.