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Numerical Simulation Of Heat Transfer Process In Grooved Mold

Posted on:2018-09-05Degree:MasterType:Thesis
Country:ChinaCandidate:T F MaFull Text:PDF
GTID:2381330572465905Subject:Power Engineering and Engineering Thermophysics
Abstract/Summary:PDF Full Text Request
The thermal conducting performance of the Grooved-Mold presents close relationship with solidification process of the shell,and has direct impacts on the quality of surface and subsurface of the solidifying shell.The regular pattern of thermal conduction of the solid shell in the mold and the impact of mold parameters can also be reflected by the thermal conducting performance of the Grooved-Mold,which consequently has significant impact on improving the quality of casting blank.This paper studies the Grooved-Mold based on the numerical simulation of ANSYS.We study the thermal conduction behavior of the copper plate in the Grooved-Mold and the solid shell in the mold.Moreover,we also analyze the impact of mold parameters on the thermal conducting performance of copper plate and the temperature field of molten steel in the mold.The major contributions of this paper include:(1)The width and depth of the groove and the ratio between these two parameters are the primary factors which have significant impacts on thermal conducting performance of the copper plate in the Grooved-Mold.The maximum temperature gradient of the copper plate is at the mold corner,when the depth of groove is between 0?4mm,the width is between 0?10mm and the width-depth ratio is greater than 3.75.While when the width-depth ratio is less than 3.75,the copper plate achieves its maximum temperature gradient at the first concave point of the groove.Therefore,the width-depth ratio of 3.75 is the critical point for improving the thermal conducting performance of the copper plate of the mold.(2)With fixed groove parameters,when the width-depth ratio is greater than 3.75,the groove has less influence on temperature distribution between the center and the corner of copper plate in the mold.When the width-depth ratio is less than 3.75,the groove has more impact on the temperature distribution of the copper plate.(3)Utilizing the groove structure in the center of the mold,despite the little influence on shell cooling performance at the corner of the mold,can help achieve even temperature distribution in the center of the mold and make the thickness of the solid shell grow more evenly.(4)With the same groove width,the larger the depth,the larger the convection heat transfer coefficient between the mold and the molten steel.When the groove width is 5mm and the groove has the depth of 1mm,2mmm and 3mm,the convection heat transfer coefficient between the mold and molten steel is smaller than that in absence of groove.When the groove depth is 4mm,the convection heat transfer coefficient will be greater than that without groove.(5)In summary,when the groove width is 5mm,using the depth of 2mm or 3mm for groove can facilitate the even growth of the solid shell thickness,and thus reduce the chance of cracking in the initial solid shell.
Keywords/Search Tags:Grooved-Mold, groove depth, groove width, solidification heat conduction, numerical simulation
PDF Full Text Request
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