Investigation On The Technique Of Acid Bright Copper Plating

The copper plating layer has excellent ductility,good electrical conductivity and good thermal conductivity,and is widely used in household appliances,household hardware,plastic plating,printed circuit boards and other fields.Electroplating copper is mainly used to obtain the intermediate plating layer or the bottom layer,improve the bonding force between the substrate and the plating layer,the plating layer and the plating layer,and reduce the amount of precious metal,which is of great significance in production practice.The coat:ing of acid bright copper plating is bright and smooth,and the bath maintenance and sewage treatment are easy.Therefore,this process is widely applied to the production of products with high appearance requirements.At present,the main problems in the brightness of acid bright copper plating in China are:(1)slow light emission;(2)the leveling effect is not satisfactory;(3)the low current density area is poor.The research works,through cooperation with developers of electroplating additives,focus to develop a new acid bright copper plating additives-ECB series additives,and strive to solve the above three problems.The formulation and operating conditions of the process are as follows:a series of Hull cell experiments and actual lithography in the grinding,degreasing,and pickling of the test piece.Copper sulfate pentahydrate 1 80-220g/LSulfuric acid 30-40ml/LChloride 5 0-100ppmECB Additive A 0.6-0.8ml/LECB Additive B 0.15-0.3ml/LECB Additive C 6-12ml/LCathode current density 1.0-6.0A/dm2Anode current density 0.5-2.5A/dm2Temperature 20-30 ?The current efficiency of the plating solution was 99.7%,the dispersing ability was 49.6%,the covering ability was 100%,and the plating deposition rate was 0.7?m/min at 3A/dm2.Through the polarization curve and scanning electron microscope observation,the performance of ECBadditive acid copper plating process is similar to that of the industry benchmark Kotac,which has good market potential.It has been officially used in some electroplating plants.In the actual production encountered some faults,this paper summarized,and put forward opinions on the management and maintenance of the plating solution,hoping to play a certain reference role for the industry.