Research On Silicon Wafer Bonding Method Based On E-jet Principle

Silicon wafer bonding technology,which combines surface silicon micromachining with bulk silicon micromachining,is a research hotspot in micromachining.As one of the most promising patterning technologies for printed electronic devices,jet printing is also widely used in the preparation of thin films and other additives for micro-nanodevices.Starting from the defects of existing bonding methods,such as stress generation,cumbersome process and high cost,this paper integrates the traditional bonding method with the principle of e-jet.A silicon wafer bonding method based on the principle of e-jet is proposed.The method is analyzed and studied from the aspects of theory,simulation and experiment,the bonding strength achieved by this method is also discussed.The feasibility of this method is verified by testing.The main research work and innovation of this paper are as follows:1.A silicon wafer bonding method based on the principle of e-jet is proposed.Based on the characteristics of high resolution,room temperature and wide adaptability of materials,this method can break through the existing barriers of silicon wafer bonding technology and lay a foundation for improving the fabrication process of micro-nanodevices.2.Theoretical analysis and numerical simulation of jet phenomena are carried out.Based on hydrodynamics and electrodynamics equations,the mathematical model of electrohydrodynamics is established,and the mathematical relationship between voltage,flow rate and jet diameter is further established.The effects of voltage,flow rate and printing height on jet diameter were further explored by simulation,and theeffects of these three parameters on the jet diameter obtained under cone-jet configuration were preliminarily revealed.3.The e-jet printing experiment of bonding fluid was completed.The bonding fluids are configured and used as the fluids for jet printing.A radio jet printing platform is built.The effects of voltage,flow rate and printing height on the diameter of bead structure printed in cone-jet configuration are revealed through a large number of experiments.The matching and mutual verification of the experimental and simulation results are realized for the bonding fluids selected in this paper.4.Design the bonding strength test scheme and complete the test.Two schemes of single-line printing and multi-lines printing were designed.The bonding fluid was printed under different conditions according to the design scheme,and a series of beaded lines were obtained.The strength test was carried out to verify the feasibility of the method.