| Micro thermoelectric devices play an important role in low power generation and refrigeration.However,due to the poor mechanical properties of Bi2Te3,the most commonly used commercial thermoelectric material,the size of three-dimensional micro thermoelectric devices is limited.On the other hand,two-dimensional micro thermoelectric devices are criticized for their high resistance.This paper proposes a new process for micro thermoelectric device molding,and builds simplied instrument for testing;Combined with the improvement of thermoelectric materials and filler properties,the molding process is optimized.Mainly carried out the following parts of the work:1.Exploring a three dimensional micro device forming method which is expected to be commercialized,a method for preparing a three dimensional micro device by cutting and bonding is proposed.The feasibility of the cutting bond method was verified by preparing a device with a thermoelectric arm size of 1.2 mm ×1.2 mm× 1.6 mm.2.The micro thermoelectric device can be successfully fabricated by the cutting and bonding method.The size of the thermoelectric arm can reach 300 ?m x300 ?m×800 ?m,which solves the difficulties in machining and array arrangement of the three-dimensional micro-thermoelectric device.3.Changing the particle size of the hot-pressed powder can effectively improve the thermoelectric properties of the materials.The zone melting are subjected to different degrees of crushing and grinding.When the particle size is 150-300?m,the room temperature zT meets 0.8.4.Efforts have been carried out on reducing the thermal conductivity of epoxy resin.Adding hollow glass beads into epoxy resin can effectively reduce thermal conductivity.When adding hollow glass microspheres with a weight ratio of 12%,the thermal conductivity of the epoxy resin is reduced by 60%.After a series of optimized cutting and bonding processes,it is expected to achieve mass production and promote the commercial application of micro devices. |
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